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2015 | OriginalPaper | Buchkapitel

4. Influence of LSP on Stress Intensity Factor of Hole-Edge Crack

verfasst von : Xudong Ren

Erschienen in: Laser Shocking Nano-Crystallization and High-Temperature Modification Technology

Verlag: Springer Berlin Heidelberg

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Abstract

This chapter focuses on the effects of the compressive residual stresses generated due to laser shock processing (LSP) on the stress intensity factor (SIF) of a through-the-thickness radial crack at the edge of the circular hole, the effects of laser shock peening on the fatigue crack initiation and propagation of 7050-T7451 aluminum alloy, and a new kind of statistical data model which described the fatigue cracking growth with limited data and the effects of the reliability and the confidence level to the fracture growth. Many materials have displayed pronounced improvements in fatigue life after LSP. It has shown that LSP treatment improves the materials mechanical properties, fatigue resistance, foreign object damage (FOD), and fatigue life.

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Vorheriges Kapitel Laser Shock Processing at Elevated Temperature

Nächstes Kapitel Conversion Model of Graphite

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Titel: Influence of LSP on Stress Intensity Factor of Hole-Edge Crack
verfasst von: Xudong Ren
Verlag: Springer Berlin Heidelberg
Buch: Laser Shocking Nano-Crystallization and High-Temperature Modification Technology
Print ISBN: 978-3-662-46443-4

Electronic ISBN: 978-3-662-46444-1

Copyright-Jahr: 2015
DOI: https://doi.org/10.1007/978-3-662-46444-1_4

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