Skip to main content
Erschienen in:
Buchtitelbild

2024 | OriginalPaper | Buchkapitel

1. Introduction

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

In computer science, there is a growing gap between what technology can do and our ability to design such systems. This is known as the design gap. Systems-on-chips (SoCs) pack in numerous components, from CPUs and GPUs to accelerators and wireless functions, making them more intricate than entire 1990s desktop computers. Manufacturing and understanding these integrated circuits is impossible without electronic design automation (EDA) tools.
The traditional sequential design phases—specification, HW design, and software design—lead to time inefficiencies and the risk of project failures due to wrong design decisions. Virtual prototyping, by allowing simultaneous software and hardware development, addresses these challenges, reducing development time by half. However, the combination of software and hardware in embedded systems demands not only verified functionality but also increased security.
While virtual prototyping has gained popularity, modeling and verification processes still are mostly manual efforts. The need for stable, open source RISC-V VPs is emphasized to accelerate innovation and improve product quality. The challenges include the long development time, inefficient design space exploration, inadequate re-use of intermediate models, lack of early system analysis tools, and a high verification hurdle.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Fußnoten
1
CISC/RISC: Complex/Reduced Instruction Set Computer. See also Sect. 2.​3 and [12].
 
2
MIPS: Microprocessor without Interlocked Pipelined Stages.
 
Literatur
1.
Zurück zum Zitat B. Menhorn, F. Slomka, Confirming the design gap, in Advances in Computational Science, Engineering and Information Technology, ed. by D. Nagamalai, A. Kumar, A. Annamalai (Springer International Publishing, Heidelberg, 2013), pp. 281–292. ISBN: 978-3-319-00951-3CrossRef B. Menhorn, F. Slomka, Confirming the design gap, in Advances in Computational Science, Engineering and Information Technology, ed. by D. Nagamalai, A. Kumar, A. Annamalai (Springer International Publishing, Heidelberg, 2013), pp. 281–292. ISBN: 978-3-319-00951-3CrossRef
5.
Zurück zum Zitat OSCI TLM-2.0 Language Reference Manual OSCI (2009) OSCI TLM-2.0 Language Reference Manual OSCI (2009)
6.
Zurück zum Zitat E. Sotiriou-Xanthopoulos, S. Xydis, K. Siozios, G. Economakos, D. Soudris, Rapid prototyping and design space exploration methodologies for many-accelerator systems, in 2015 25th International Conference on Field Programmable Logic and Applications (FPL) (2015), pp. 1–2. https://doi.org/10.1109/FPL.2015.7293990 E. Sotiriou-Xanthopoulos, S. Xydis, K. Siozios, G. Economakos, D. Soudris, Rapid prototyping and design space exploration methodologies for many-accelerator systems, in 2015 25th International Conference on Field Programmable Logic and Applications (FPL) (2015), pp. 1–2. https://​doi.​org/​10.​1109/​FPL.​2015.​7293990
9.
Zurück zum Zitat O. Hagenbruch, Taschenbuch Mikroprozessortechnik (Hanser Verlag, Munich, 2004). ISBN: 978-3446220720 O. Hagenbruch, Taschenbuch Mikroprozessortechnik (Hanser Verlag, Munich, 2004). ISBN: 978-3446220720
12.
Zurück zum Zitat E. Blem, J. Menon, K. Sankaralingam, Power struggles: revisiting the RISC vs. CISC debate on contemporary ARM and x86 architectures, in 2013 IEEE 19th International Symposium on High Performance Computer Architecture (HPCA) (2013), pp. 1–12. https://doi.org/10.1109/HPCA.2013.6522302 E. Blem, J. Menon, K. Sankaralingam, Power struggles: revisiting the RISC vs. CISC debate on contemporary ARM and x86 architectures, in 2013 IEEE 19th International Symposium on High Performance Computer Architecture (HPCA) (2013), pp. 1–12. https://​doi.​org/​10.​1109/​HPCA.​2013.​6522302
13.
Zurück zum Zitat S.B. Furber, ARM System-on-Chip Architecture (Pearson Education, London, 2000). ISBN: 978-0201675191. S.B. Furber, ARM System-on-Chip Architecture (Pearson Education, London, 2000). ISBN: 978-0201675191.
28.
Zurück zum Zitat Y. Xu et al., Processors using agile methodology, in 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO) (2022), pp. 1178–1199 Y. Xu et al., Processors using agile methodology, in 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO) (2022), pp. 1178–1199
31.
Zurück zum Zitat N. Bruns, V. Herdt, D. Große, R. Drechsler, Efficient cross-level processor verification using coverage-guided fuzzing, in Proceedings of the Great Lakes Symposium on VLSI 2022, ser. GLSVLSI ’22, Irvine (Association for Computing Machinery, New York, 2022), pp. 97–103. ISBN: 9781450393225 [Online]. Available: https://doi.org/10.1145/3526241.3530340 N. Bruns, V. Herdt, D. Große, R. Drechsler, Efficient cross-level processor verification using coverage-guided fuzzing, in Proceedings of the Great Lakes Symposium on VLSI 2022, ser. GLSVLSI ’22, Irvine (Association for Computing Machinery, New York, 2022), pp. 97–103. ISBN: 9781450393225 [Online]. Available: https://​doi.​org/​10.​1145/​3526241.​3530340
33.
Zurück zum Zitat S. Tempel, V. Herdt, R. Drechsler, SISL: concolic testing of structured binary input formats via partial specification, in Automated Technology for Verification and Analysis, ed. by A. Bouajjani, L. Holík, Z. Wu (Springer International Publishing, Cham, 2022), pp. 77–82. ISBN: 978-3-031-19992-9CrossRef S. Tempel, V. Herdt, R. Drechsler, SISL: concolic testing of structured binary input formats via partial specification, in Automated Technology for Verification and Analysis, ed. by A. Bouajjani, L. Holík, Z. Wu (Springer International Publishing, Cham, 2022), pp. 77–82. ISBN: 978-3-031-19992-9CrossRef
36.
Zurück zum Zitat V. Herdt, D. Große, J. Wloka, T. Güneysu, R. Drechsler, Verification of embedded binaries using coverage-guided fuzzing with systemc-based virtual prototypes, in Proceedings of the 2020 on Great Lakes Symposium on VLSI, ser. GLSVLSI’20, Virtual Event (Association for Computing Machinery, New York, 2020), pp. 101–106. ISBN: 9781450379441 [Online]. Available: https://doi.org/10.1145/3386263.3406899 V. Herdt, D. Große, J. Wloka, T. Güneysu, R. Drechsler, Verification of embedded binaries using coverage-guided fuzzing with systemc-based virtual prototypes, in Proceedings of the 2020 on Great Lakes Symposium on VLSI, ser. GLSVLSI’20, Virtual Event (Association for Computing Machinery, New York, 2020), pp. 101–106. ISBN: 9781450379441 [Online]. Available: https://​doi.​org/​10.​1145/​3386263.​3406899
37.
Zurück zum Zitat N. Bruns, V. Herdt, R. Drechsler, Unified HW/SW coverage: a novel metric to boost coverage-guided fuzzing for virtual prototype based HW/SW co-verification, in Forum on Specification and Design Languages, FDL 2022, Linz, September 14–16, 2022 (IEEE, Piscataway, 2022), pp. 1–8 [Online]. Available: https://doi.org/10.1109/FDL56239.2022.9925661 N. Bruns, V. Herdt, R. Drechsler, Unified HW/SW coverage: a novel metric to boost coverage-guided fuzzing for virtual prototype based HW/SW co-verification, in Forum on Specification and Design Languages, FDL 2022, Linz, September 14–16, 2022 (IEEE, Piscataway, 2022), pp. 1–8 [Online]. Available: https://​doi.​org/​10.​1109/​FDL56239.​2022.​9925661
39.
Zurück zum Zitat P. Pieper, V. Herdt, R. Drechsler, Advanced environment modeling and interaction in an open source RISC-V virtual prototype, in Proceedings of the Great Lakes Symposium on VLSI 2022, ser. GLSVLSI ’22, Irvine (Association for Computing Machinery, New York, 2022), pp. 193–197. ISBN: 9781450393225. https://doi.org/10.1145/3526241.3530374 P. Pieper, V. Herdt, R. Drechsler, Advanced environment modeling and interaction in an open source RISC-V virtual prototype, in Proceedings of the Great Lakes Symposium on VLSI 2022, ser. GLSVLSI ’22, Irvine (Association for Computing Machinery, New York, 2022), pp. 193–197. ISBN: 9781450393225. https://​doi.​org/​10.​1145/​3526241.​3530374
44.
Zurück zum Zitat P. Pieper, R. Wimmer, G. Angst, R. Drechsler, Minimally invasive HW/SW co-debug live visualization on architecture level, in Proceedings of the 2021 on Great Lakes Symposium on VLSI, ser. GLSVLSI ’21, Virtual Event (Association for Computing Machinery, New York, 2021), pp. 321–326. ISBN: 9781450383936. https://doi.org/10.1145/3453688.3461524 P. Pieper, R. Wimmer, G. Angst, R. Drechsler, Minimally invasive HW/SW co-debug live visualization on architecture level, in Proceedings of the 2021 on Great Lakes Symposium on VLSI, ser. GLSVLSI ’21, Virtual Event (Association for Computing Machinery, New York, 2021), pp. 321–326. ISBN: 9781450383936. https://​doi.​org/​10.​1145/​3453688.​3461524
52.
Zurück zum Zitat S. Ahmadi-Pour, P. Pieper, R. Drechsler, Virtual-peripheral-in-the-loop: a hardware-in-the-loop strategy to bridge the VP/RTL design-gap (2023). arXiv:2311.00442 [cs.AR] S. Ahmadi-Pour, P. Pieper, R. Drechsler, Virtual-peripheral-in-the-loop: a hardware-in-the-loop strategy to bridge the VP/RTL design-gap (2023). arXiv:2311.00442 [cs.AR]
Metadaten
Titel
Introduction
verfasst von
Pascal Pieper
Rolf Drechsler
Copyright-Jahr
2024
DOI
https://doi.org/10.1007/978-3-031-51692-4_1

Neuer Inhalt