Anzeige
Erschienen in:
01.10.2010
Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 10/2010
EinloggenAktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
Abstract
The lab-designed drop tests and the pendulum-type impact tests were used to study the effect of high-velocity impact on the fracture morphologies of the Sn3.8Ag0.7Cu (wt. %) solder joints. The U-notch butted-type specimen was selected. The typical fracture morphologies created by the high-velocity tests were compared. It is believed that the large Ag3Sn platelets precipitated at the Cu/solder interfaces after air cooling provided the initiation site for cracking and caused the brittle fracture. Using SEM, the fracture morphologies along the interfacial Ag3Sn intermetallic compounds (IMCs) were observed on the fracture surfaces. The results showed that the fracture morphologies were a function of the stress state and the orientation of the Ag3Sn platelets within the solder joints strongly influenced the fracture morphology.