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Erschienen in:
01.10.2010
Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 10/2010
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Abstract
The effect of Sn-rich coarsening in Sn–Ag–Cu solder joints produced by isothermal annealing was investigated. The isothermal annealing temperatures employed were from 30 to 150 °C for 24 h up to 1,008 h of annealing time. An Infinite Focus Measurement system (IFM®) and Scanning Electron Microscopy-Energy Dispersive Spectroscopy (SEM-EDS) were used for microscopic analysis and elemental analysis, respectively. As the annealing time and temperature increased, a eutectic component Cu, diffused into the Sn-rich phases, coarsening the Sn-rich phases, and the activation energy value for the coarsening was determined to be 41 kJ/mol.