Ausgabe 1/2006
Inhalt (30 Artikel)
Foreword
Sinn-Wen Chen, C. Robert Kao, Hyuck Mo Lee, Suzanne Mohney, Katsuaki Suganuma, Douglas J. Swenson, Srinivas Chada
Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder
Yung-Chi Lin, Jenq-Gong Duh, Bi-Shiou Chiou
Crystallization and failure behavior of Ta-TM (TM=Fe, Co) nanostructured/amorphous diffusion barriers for copper metallization
J. S. Fang, T. P. Hsu, G. S. Chen
Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging
Moon Gi Cho, Kyung Wook Paik, Hyuck Mo Lee, Seong Woon Booh, Tae-Gyu Kim
Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems
Keun-Soo Kim, Toshinori Matsuura, Katsuaki Suganuma
Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates
J. Y. Tsai, C. W. Chang, C. E. Ho, Y. L. Lin, C. R. Kao
Interfacial reactions in the pb-free composite solders with indium layers
Sinn-Wen Chen, Shih-Kang Lin, Ching-Feng Yang
Thermal performance of sputtered insoluble Cu(W) films for advanced barrierless metallization
J. P. Chu, C. H. Lin, Y. Y. Hsieh
Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles
Li-Yin Hsiao, Szu-Tsung Kao, Jenq-Gong Duh
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys
C. M. T. Law, C. M. L. Wu, D. Q. Yu, L. Wang, J. K. L. Lai
Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints
I. E. Anderson, J. L. Harringa
Effect of KOH treatment on the schottky barrier height and reverse leakage current in Pt/n-GaN
Ho Gyoung Kim, Sang Ho Kim, Parijat Deb, Tim Sands
The effects of hydrogen on aluminum-induced crystallization of sputtered hydrogenated amorphous silicon
Maruf Hossain, Husam H. Abu-Safe, Hameed Naseem, William D. Brown
Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding
Rashed Adnan Islam, Y. C. Chan
A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys
Ken-Ichi Ohguchi, Katsuhiko Sasaki, Masahiro Ishibashi
The electrical behavior of nitro oligo(phenylene ethynylene)’s in pure and mixed monolayers
Nabanita Majumdar, N. Gergel-Hackett, J. C. Bean, L. R. Harriott, G. Pattanaik, G. Zangari, Y. Yao, J. M. Tour
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
Yu-Chih Liu, Wei-Hong Lin, Hsiu-Jen Lin, Tung-Han Chuang
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
Hsiu-Jen Lin, Tung-Han Chuang
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
S. S. Wang, Y. H. Tseng, T. H. Chuang
Ultrathin CdSe nanowire field-effect transistors
Anubhav Khandelwal, Debdeep Jena, James W. Grebinski, Katherine Leigh Hull, Masaru K. Kuno
Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires
Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang, Herbert Reichl
Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
M. L. Huang, T. Loeher, D. Manessis, L. Boettcher, A. Ostmann, H. Reichl
Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly
J. W. Hwang, M. J. Yim, K. W. Paik