Ausgabe 5/2009
Inhalt (13 Artikel)
The Potential of the Perturbed Angular Correlation Technique in Characterizing Semiconductors
Rakesh Dogra, A.P. Byrne, M.C. Ridgway
Low-Dimensional Waveguide Grating Fabrication in GaN with Use of SiCl4/Cl2/Ar-Based Inductively Coupled Plasma Dry Etching
R. Dylewicz, S. Patela, R. A. Hogg, P. W. Fry, P. J. Parbrook, R. Airey, A. Tahraoui
Evolution of Luminescence from Doped Gallium Phosphide over 40 Years
Sergei Pyshkin, John Ballato, Michael Bass, Giorgio Turri
In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal
I. Lum, C. J. Hang, M. Mayer, Y. Zhou
Lead-Free Bumping Using an Alternating Electromagnetic Field
Hongbo Xu, Mingyu Li, Hongtao Chen, Yonggao Fu, Ling Wang
Thermomechanical Stress and Strain in Solder Joints During Electromigration
J.S. Zhang, H.J. Xi, Y.P. Wu, F.S. Wu
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
Y. K. Jee, J. Yu, K. W. Park, T. S. Oh
Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4 Solutions
Ja-Young Jung, Shin-Bok Lee, Ho-Young Lee, Young-Chang Joo, Young-Bae Park
High-Temperature Capacitor Materials Based on Modified BaTiO3
Y. Yuan, S.R. Zhang, X.H. Zhou, B. Tang, B. Li
Microwave Dielectric Properties of ZnO-2TiO2-Nb2O5 Ceramics with BaCu (B2O5) Addition
Huanfu Zhou, Hong Wang, Kecheng Li, Haibo Yang, Minghui Zhang, Xi Yao