Ausgabe 6/2008
Inhalt (21 Artikel)
Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures
T.-S. Park, M. Dao, S. Suresh, A.J. Rosakis, D. Pantuso, S. Shankar
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations
V. Vuorinen, H. Yu, T. Laurila, J.K. Kivilahti
Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound
Seishi Kumamoto, Hitoshi Sakurai, Youichi Kukimoto, Katsuaki Suganuma
Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System as a Basis for Ternary Diffusion Soldering
Vincent Grolier, Rainer Schmid-Fetzer
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling
E.H. Wong, C.S. Selvanayagam, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, L.C. Tan, D.R. Frear, M. Leoni, Y.-S. Lai, C.-L. Yeh
Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders
Wenming Tang, Anqiang He, Qi Liu, Douglas G. Ivey
Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films
C.S. Hsu, H.Y. Hsieh, J.S. Fang
The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM
Hwa-Teng Lee, Shuen-Yuan Hu, Ting-Fu Hong, Yin-Fa Chen
Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy
Ping Liu, Pei Yao, Jim Liu
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability
Luhua Xu, John H. L. Pang, Faxing Che
Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints
Min-Na Chen, Shi-Jin Ding, Qing-Qing Sun, David Wei Zhang, Li-Kang Wang
Novel Cu/Cr/Ge/Pd Ohmic Contacts on Highly Doped n-GaAs
Kartika Chandra Sahoo, Chun-Wei Chang, Yuen-Yee Wong, Tung-Ling Hsieh, Edward Yi Chang, Ching-Ting Lee
a-Si:C:H and a-Si:N:H Thin Films Obtained by PECVD for Applications in Silicon Solar Cells
T. Stapinski, B. Swatowska
Magneto-transport Properties of a GaMnAs-Based Ferromagnetic Semiconductor Trilayer Structure Grown on a ZnMnSe Buffer
S.J. Chung, D.Y. Shin, Hyungchan Kim, Sanghoon Lee, X. Liu, J.K. Furdyna
Structural and Chemical Comparison of Graphite and BN/AlN Caps Used for Annealing Ion Implanted SiC
K.A. Jones, M.C. Wood, T.S. Zheleva, K.W. Kirchner, M.A. Derenge, A. Bolonikov, T.S. Sudarshan, R.D. Vispute, S.S. Hullavarad, S. Dhar
Preparation and Characterization of Polyimide/Zirconia Composite Films
Sea-Fue Wang, Yuh-Ruey Wang, Kuo-Chung Cheng, Jyh-Herng Chen, Yu-Ping Hsaio
Electrical Conductivity, Thermoelectric Power, and Optical Properties of Organo-Soluble Polyaniline Organic Semiconductor
Fahrettin Yakuphanoglu, Bahİre Fİlİz Şenkal, Ayfer Saraç
Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis
Yi-Shao Lai, Chin-Li Kao