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Erschienen in: Wireless Personal Communications 3/2014

01.12.2014

Ka-Band Four-Way Power Combiner Based on Multi-layer Substrate Integrated Waveguide

verfasst von: Kaijun Song, Fulong Chen, Fan Zhang, Yong Fan

Erschienen in: Wireless Personal Communications | Ausgabe 3/2014

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Abstract

A novel millimeter-wave power divider/combiner based on rectangular waveguide to multi-layer substrate integrated waveguide (RWG—MLSIW) transition is proposed in this paper. The input signal can be divided into N way directly by using multi-layer substrate integrated waveguides stacked together and plugged into a normal rectangular waveguide. A four-way multi-layer SIW power combiner operating at Ka-band is designed, fabricated and measured. Good agreement between the experiments and the simulations can be observed, demonstrating 8 GHz bandwidth (from 29 to 37 GHz) with 15-dB input return loss.

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Metadaten
Titel
Ka-Band Four-Way Power Combiner Based on Multi-layer Substrate Integrated Waveguide
verfasst von
Kaijun Song
Fulong Chen
Fan Zhang
Yong Fan
Publikationsdatum
01.12.2014
Verlag
Springer US
Erschienen in
Wireless Personal Communications / Ausgabe 3/2014
Print ISSN: 0929-6212
Elektronische ISSN: 1572-834X
DOI
https://doi.org/10.1007/s11277-014-1953-2

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