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Erschienen in:
3D Integration Technologies – An Overview Kapitel lesen Erstes Kapitel lesen

2009 | OriginalPaper | Buchkapitel

5. Lead-Free Soldering

verfasst von : Ning Cheng Lee

Erschienen in: Materials for Advanced Packaging

Verlag: Springer US

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Abstract

Due to the global trend of green manufacturing, lead-free becomes the main stream soldering choice of electronic industry. SnAgCu alloys are the prevailing choices, with SnCu(+Y), SnAg(+Y), and BiSn(+Y) families also being adopted, where Y represents minor additive elements. The soldering processing window is narrower than that of Sn63, mainly due to the elevated melting temperature of SnAgCu solder and the limited high temperature tolerance of components and board. The high surface tension of Sn aggravates the difficulty in wetting, while the high reactivity of Sn puts more constraint in contact time allowed between molten solder and base metal or solder container. The creep rate of SnAgCu is slower at low stress, but faster at high stress than Sn63. This results in a longer temperature cycling life at low joint strain applications, but a shorter cycling life at high joint strain applications. Higher Cu content stabilizes IMC structure at interface between SnAgCu solder and NiAu. The high rigidity of SnAgCu solders enhances the fragility of joints, although significant improvement has been accomplished via low Ag or high Cu content or doping approaches.

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Vorheriges Kapitel Advanced Wire Bonding Technology: Materials, Methods, and Testing
Nächstes Kapitel Thin Die Production
Literatur
1.
IPC Global Solder Statistical Program Report for 2nd Quarter 2007, August 2007
2.
“Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by John H. Lau, C. P. Wong, Ning-Cheng Lee, S. W. Ricky Lee. Hardcover: 700 pages, 1st edition (August 27, 2002), by McGraw-Hill.
3.
C. Hunt and D. Lea, “Solderability of Lead-Free Alloys”, in Proceedings of Apex 2000, Long Beach, CA, March 2000.
4.
5.
6.
Weiping Liu and Ning-Cheng Lee, “Novel SACX Solders with Superior Drop Test Performance”, SMTA International, Chicago, IL, September, 2006
7.
8.
Benlih Huang and Ning-Cheng Lee, “Prospect of Lead Free Alternatives for Reflow Soldering”, IMAPS’99 – Chicago.
9.
10.
11.
12.
M. Date, T. Shoji, M. Fujiyoshi, and K. Sato, “Pb-free Solder Ball with Higher Impact Reliability”, Intel Pb-free Technology Forum, 18th – 20th July 2005, Penang, Malaysia.
13.
Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “A Compliant and Creep Resistant SAC-Al(Ni) Alloy”, ECTC, Reno, Nevada, May 26-June 1, 2007
14.
15.
Masazumi Amagai, “A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance”, 56th ECTC Proceedings, pp. 1170–1190, San Diego, CA, May 30–June 2, 2006
16.
Benlih Huang and Ning-Cheng Lee, “Prospect of Lead Free Alternatives for Reflow Soldering”, IMAPS’99 – Chicago
17.
Ning-Cheng Lee, “Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization”, International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference, Taipei, Taiwan, Oct. 1–3, 2007.
18.
Guo-yuan Li, and Xun-qing SHI, “Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints”, Transactions of Nonferrous Metals Society of China, Volume 16, Supplement 2, June 2006, pp. s739–s743
19.
Zequn Mei, Fay Hua, and Judy Glazer, “SN-BI-X Solders”, SMTA International, San Jose, CA, Sept. 13–17, 1999.
20.
K. Suganuma, “Japan Leadfree 2001”.
21.
T. Baggio, “The Panasonic Mini Disk Player – Turning a New Leaf in a Lead-Free Market”, IPCWorks’99, Minneapolis, MN, Oct. 27, 1999.
22.
“Lead-free Electronics”, Editor(s): Sanka Ganesan, Michael Pecht, 2003 CALCE EPSC Press., p. 444.
23.
Toshikazu Yamaguchi and Takao Enomoto, “Tin-Zinc Solder Paste”, Apex, San Diego, CA, Jan. 14–18, 2001
24.
Günter Grossmann, Giovanni Nicoletti, Ursin Solèr , “Results of Comparative Reliability Tests on Lead-free Solder Alloys”, 52nd ECTC, S30-P1, San Diego, CA, May 28–31, 2002.
25.
Hirokazu Tanaka, Yuuichi Aoki, Makoto Kitagawa and Yoshiki Saito, “Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress”, Apex, S28-1, Anaheim, CA, Feb. 2004
26.
J. Glazer, “Metallurgy of low temperature Pb-free solders for electronic assembly”, International Materials Reviews, vol. 40, No. 2, pp. 65–93 (1995).
27.
“Lead-Free Solder”, Manufacturing Market Insider, pp. 6 (Oct., 1993).
28.
Judy Glazer, “Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: a review”, J. Electronic Materials, vol. 23, no. 8, pp. 693–700 (Aug. 1994).CrossRef
29.
Valeska Schroeder, and Fay Hua, “Feasibility Study of 57Bi-42Sn-1Ag Solder”, Apex, San Diego, CA, Jan. 14–18, 2001
30.
S.G. Gonya, J.K. Lake, R.C. Long, R.N. Wild, “Lead-free tin-bismuth solder alloys”, IBM, Armonk, NY, US Patent 5,368,814, Nov. 29, 1994.
31.
IPC J-STD-006B Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications, Jan. 2006.
32.
Ning-Cheng Lee, “Combining Superior Anti-Oxidation and Superior Print - Is it Really Impossible?”, EPP EUROPE DECEMBRE 2007, pp. 20–21.
33.
Paul Jaeger and Ning-Cheng Lee, “A Model Study of Low Residue No-Clean Solder Paste”, in Proceeding of Nepcon West, Anaheim, CA, 1992.
34.
Ning-Cheng Lee, “Reflow Soldering Processes and Troubleshooting – SMT, BGA, CSP and Flip Chip Technologies”, Newnes, pp. 269, 2001.
35.
“Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing”, edited by Edwin Bradley, Carol A. Handwerker, Jasbir Bath, Richard D. Parker, and Ronald W. Gedney, 472 pages, published by Wiley-IEEE, 2007.
36.
K. Wengenroth, Y. Yau, F. Fudala, R. Prendergast, and J. Abys, “Alternative final finishes for PWB”, QuickStart Lead-free Workshop, Ft. Lauderdale, FL, July, 27, 2004.
37.
Walter Horaud, Sylvain Leroux, Hélène Frémont, Dominique Navarro, “PCB Materials Behaviours towards Humidity “, Apex, S07-2, Anaheim, CA, Feb. 2004
38.
Sammy Shina, Liz Harriman, Todd MacFadden, Donald Abbott, Richard Anderson, Helena Pasquito, George Wilkish, Marie Kistler, David Pinsky, Mark Quealy, Karen Walters, Richard McCann, and Al Grusby, “Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing”, Apex, S29-4, Anaheim, CA, Feb. 2004
39.
Koji Saeki, and Michael Carano, “Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates”, Apex, S10-2, Anaheim, CA, Feb. 2004
40.
U. Ray, I. Artaki, D.W. Finley, G.M. Wenger, T. Pan, H.D. Blair, J.M. Nicholson, and P. T. Vianco, “Assessment of Circuit Board Surface Finishes for Electronic Assembly with Lead-Free Solders”, SMI 96, Sep. 10–12, 1996, San Jose, CA
41.
Muffadal Mukadam, Norman Armendariz*, Raiyo Aspandiar, Mike Witkowski, Victor Alvarez, Andrew Tong, Betty Phillips, and Gary Long (Intel Corporation), “Planar microvoiding in lead-free second-level interconnect solder joints”, SMTAI, Sep., 2006, Chicago, IL
42.
John Swanson and Donald Cullen, “Verifying microvoid elimination and prevention via an optimized immersion silver process”, APEX, S18-01, Feb. 20–22, 2007, Los Angeles, CA
43.
Yung-Herng Yau, Karl Wengenroth and Joseph Abys, “A study of planar microvoiding in Pb-free solder joints“, APEX, S18-02, Feb. 20–22, 2007, Los Angeles, CA
44.
Jing Li Fang, Daniel K. Chan, “The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability”, APEX, S23-02, Feb. 20–22, 2007, Los Angeles, CA
45.
IPC/JEDEC J-STD-020D June 2007 Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.
46.
Cho-Liang Chung, Liang-Tien Lu and Yao-Jung Lee, “Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)”, Microelectronics and Reliability, Vol. 45, No. 12, Dec. 2005, pp. 1916–1923.CrossRef
47.
{Lead-Free Component Team}, “Component Implications of Lead-Free Reflow Assembly”, IPC/NEMI Symposium on Lead-Free Electronics, Sep. 18–19, 2002, Montreal, Canada
48.
Vijay Gopalakrishnan, Vivek Venkataraman, Robert Murcko, Krishnaswami Srihari, Scott J. Anson, “Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures”, Apex, S19-3, Anaheim, CA, Feb. 2004
49.
Arshad Khan, Rex Lam, and Bruce Houghton, “Printed Circuit Board Reliability in High Temperature Lead-Free Processes”, Printed Circuit Board Reliability in High Temperature Lead-Free Processes”, Apex, S40-1, Anaheim, CA, Feb. 2004
50.
L.J. Turbini, W.R. Bent, W.J. Ready, “Impact of higher melting lead-free solders on the reliability of printed wiring assemblies”, SMTA International, Chicago, IL, Sep. 20–24, 2000.
51.
Edward Kelley, “An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability”, Apex, S16-2-1, Anaheim, CA, Feb. 2004
52.
Alan Rae, “Improved Electrical Properties of Epoxy Molding Compound and Circuit Board Materials Using Halogen-Free Flame Retardant Systems”, Apex, P5-05, Anaheim, CA, Feb. 2004
53.
Christiane Faure, Jean-François Couderc, Gilbert Zanon, Kim Hyland, Dennis Willie, “Lead Free Assembly: Process Considerations”, IPC/Soldertec Global 3rd International Conference on Lead Free Electronics”, Barcelona, Spain, June 8–9, 2005.
54.
C. A. Harper, Electronic Packaging and Interconnection Handbook, McGraw-Hill, New York, 1991.
55.
Jasbir Bath, “Lead-free Reflow Process Experience {Lead-Free Process Team}”, IPC/NEMI Symposium on Lead-Free Electronics, Sep. 18–19, 2002, Montreal, Canada
56.
Sammy Shina, Hemant Belbase, Karen Walters, Tom Bresnan, Peter Biocca, Tim Skidmore, David Pinsky, Phil Provencal, Don Abbott, “Selecting Material and Process Parameters for Lead-Free SMT Soldering Using Design of Experiments Techniques”, Apex, San Diego, CA, Jan. 14–18, 2001
57.
Yueli Liu, Guoyun Tian, Shyam Gale, R. Wayne Johnson, and Pradeep Lall, and Larry Crane, “Lead Free Assembly of Chip Scale Packages”, Apex, S34-1, Anaheim, CA, Feb. 2004
58.
Vahid Goudarzi, “Pb-free Manufacturing Process Development and Implementation”, Indium Corporation “Quick Start” Workshop, Libertyville, IL, Sep. 2004.
59.
Sam Yoon and Roy Wu, Jasbir Bath, Chris Chou and Samson Lam, “Assembly, Rework and Reliability of Lead-free FCBGA Soldered Component”, Apex, S29-2-1, Anaheim, CA, Feb. 2004
60.
Ning-Cheng Lee, “Critical Parameters in Voiding Control At Reflow Soldering”, Chip Scale Review, August–September 2005.
61.
H. Ladhar and S. Sethuraman, “Assembly Issues with Microvia Technologies”, SMTA International, Chicago, IL, Sept. 2003.
62.
Yan Liu, William Manning, Benlih Huang, and Ning-Cheng Lee, “A Model Study of Profiling for Voiding Control at Lead-free Reflow Soldering”, Nepcon Shanghai, China, April 11, 2005
63.
Jennifer Nguyen, Robert Thalhammer, David Geiger, Harald Fockenberger and Dongkai Shangguan, “Large and Thick Board Lead-Free Wave Soldering Optimization”, APEX, S34-01, Feb. 20–22, 2007, Los Angeles, CA
64.
65.
Bala Nandagopal, Sue Teng and Doug Watson, “Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering“, APEX, S08-01, Feb. 20–22, 2007, Los Angeles, CA
66.
Jennifer Nguyen, Robert Thalhammer, David Geiger, Harald Fockenberger and Dongkai Shangguan, “Large and Thick Board Lead-Free Wave Soldering Optimization”, APEX, S34-01, Feb. 20–22, 2007, Los Angeles, CA
67.
Ernesto Ferrer, Elizabeth Benedetto, Gary Freedman, Francois Billaut, Helen Holder, David Gonzalez, “Reliability of Partially Filled SAC305 Through-Hole Joints”, APEX, Anaheim, CA, S29-02, Feb. 5–10, 2006
68.
Michael J Smith, “Test and Inspection of Lead-Free Assemblies”, Apex, S27-3, Anaheim, CA, Feb., 2004
69.
Jasbir Bath, “Lead-free Reflow Process Experience {Lead-Free Process Team}”, IPC/NEMI Symposium on Lead-Free Electronics, Sep. 18–19, 2002, Montreal, Canada
70.
Mark Cannon, “Lead Free First Article Inspection: The Key to Success”, Apex, S05-5, Anaheim, CA, Feb. 2004
71.
Gold Goudarzi and Olga Diaz, “Lead free repair process”, QuickStart Lead Free Soldering Workshop, Oct. 07, 2003, Ft. Lauderdale, FL.
72.
Paul Wood, “Lead-Free Array Rework - What's Important In Lead Free Rework”, Nepcon Shenzhen, August 30th, 2005
73.
Sam Yoon and Roy Wu, Jasbir Bath, Chris Chou and Samson Lam, “Assembly, Rework and Reliability of Lead-free FCBGA Soldered Component”, Apex, S29-2-1, Anaheim, CA, Feb. 2004
74.
Sung K. Kang, Won Kyoung Choi, Da-Yuan Shih, Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Charles Goldsmith and Karl J. Puttlitz, “Formation of Ag3Sn Plates in Sn-Ag-Cu Alloys and Optimization of their Alloy Composition”, 53rd Electronic Components & Technology Conference, S02P5C, New Orleans, LA, May 27–30, 2003
75.
Polina Snugovsky, Zohreh Bagheri, Matthew Kelly, Marianne Romansky, “Solder joint formation with Sn-Ag-Cu and Sn-Pb solder balls and pastes”, SMTA International, September 22–26, 2002, Chicago, IL
76.
Private communication with Denis Barbini, Soltec.
77.
C. Robert Kao, “Cross-interaction between Cu and Ni in lead-free solder joints”, TMS Lead Free Workshop, San Antonia, TX, March 12, 2006.
78.
Henry Y. Lu, Haluk Balkan, Joan Vrtis, and K.Y. Simon Ng, “Impact of Cu Content on the Sn-Ag-Cu Interconnects”, 55th ECTC, P.113-119, May 31–June 3, 2005
79.
K. Zeng and K. N. Tu, “Reliability Issues of Pb-free Solder Joints in Electronic Packaging Technology”, Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595, USA, to be published in 2002.
80.
J. Kivilahti, Helsinki University of Technology, Finland
81.
Fubin Song and S. W. Ricky Lee, “Investigation of IMC Thickness Effect on the Lead-free Solder Ball Attachment Strength: Comparison between Ball Shear Test and Cold Bump Pull Test Results”, 56th ECTC Proceedings, pp. 1196–1203, San Diego, CA, May 30–June 2, 2006
82.
Luhua Xu and John H.L. Pang, “Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-free BGA Solder Joint”, 56th ECTC Proceedings, pp. 275–282, San Diego, CA, May 30–June 2, 2006
83.
Michael Osterman, Abhijit Dasgupta, and Bongtae Han, “A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects”, 56th ECTC Proceedings, pp. 884–890, San Diego, CA, May 30–June 2, 2006
84.
S. Terashima, Y. Kariya, T. Hosoi, and M. Tanaka, “Effect of silver content on thermal fatigue life of Sn-xAg-0.5 Cu flip-chip interconnects “, Journal of Electronic Materials, Vol. 32, No. 12, p.1527 (2003).CrossRef
85.
A.R. Zbrzeznya, P. Snugovskya, D.D. Perovicb, “Reliability of Lead-Free Chip Resistor Solder Joints Assembled on Boards with Different Finishes Using Different Reflow Cooling Rates”, IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, March 18–19, 2004
86.
Edwin Bradley, “Lead-Free Solder Assembly: Impact and Opportunity”, 53rd Electronic Components & Technology Conference, S02P1C, New Orleans, LA, May 27–30, 2003
87.
Gordon Gray, “Lead-free soldering for CSP”, IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, March 18–19, 2004
88.
Vijay Wakharkar and Ashay Dani, “Microelectronic Packaging Materials Microelectronic Packaging Materials Development & Integration Development & Integration Challenges for Lead Free Challenges for Lead Free”, Lead-free workshop, TMS, San Antonio, TX, March 12, 2006.
89.
M. Date, T. Shoji, M. Fujiyoshi, and K. Sato, “Pb-free Solder Ball with Higher Impact Reliability”, Intel Pb-free Technology Forum, 18th–20th July 2005, Penang, Malaysia
90.
Donald Henderson, “On the question of SAC solder alloy – Cu pad solder joint fragility”, Webcast Meeting on SAC Solder Joint Fragility, Binghamton, NY, Sep. 2004.
91.
P.A. Kondos & S. Mandke, “Kirkendall voiding in Cu pads and other pad issus”, UIC Fragile SAC Joint Meeting. Binghamton, NY, Oct. 7, 2004.
92.
Weiping Liu and Ning-Cheng Lee, “Novel SACX Solders with Superior Drop Test Performance”, SMTA International, Chicago, IL, Sep. 2006
93.
Weiping Liu, Paul Bachorik, and Ning-Cheng Lee, “The Superior Drop Test Performance of SACTi Solders and Its Mechanism”, ECTC, Las Vegas, NV, June 2008.
94.
Masazumi Amagai, Yoshitaka Toyoda, Tsukasa Ohnishi, Satoru Akita, “High Drop Test Reliability: Lead-free Solders”, 54th ECTC, P.1304-1309, June 1–4, 2004, Las Vegas, Nevada.
95.
Masazumi Amagai, “A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance”, 56th ECTC Proceedings, P. 1170–1190, San Diego, CA, May 30–June 2, 2006
96.
Benlih Huang, Hong-Sik Hwang, and Ning-Cheng Lee, “A Compliant and Creep Resistant SAC-Al(Ni) Alloy”, ECTC, Reno, Nevada, May 26–June 1, 2007
97.
Minna Arra, DongJi Xie and Dongkai Shangguan, “Performance of Lead-Free Solder Joints Under Dynamic Mechanical Loading”, 52nd ECTC, S30-P4, San Diego, CA, May 28–31, 2002.
98.
Minna Arra, Todd Castello, Dongkai Shangguan, Eero Ristolainen, “Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings”, SMTAI, pp.728–734, Chicago, IL, Sep. 2003.
99.
Robert Darveaux, Corey Reichman, Nokibul Islam, “Interface Failure in Lead Free Solder Joints”, 56th ECTC Proceedings, P. 906–917, San Diego, CA, May 30–June 2, 2006
100.
Fubin Song and S. W. Ricky Lee, “Investigation of IMC Thickness Effect on the Lead-free Solder Ball Attachment Strength: Comparison between Ball Shear Test and Cold Bump Pull Test Results”, 56th ECTC Proceedings, P. 1196–1203, San Diego, CA, May 30–June 2, 2006
Metadaten
Titel
Lead-Free Soldering
verfasst von
Ning Cheng Lee
Copyright-Jahr
2009
Verlag
Springer US
Buch
Materials for Advanced Packaging

Print ISBN: 978-0-387-78218-8

Electronic ISBN: 978-0-387-78219-5

Copyright-Jahr: 2009

DOI
https://doi.org/10.1007/978-0-387-78219-5_5

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