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Erschienen in: The International Journal of Advanced Manufacturing Technology 5-6/2004

01.09.2004 | Original Article

Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance

verfasst von: K. Liu, X. P. Li, M. Rahman, X. D. Liu

Erschienen in: The International Journal of Advanced Manufacturing Technology | Ausgabe 5-6/2004

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Abstract

In this study, ductile mode chip formation in conventional cutting and ultrasonic vibration assisted cutting of tungsten carbide workpiece material has been investigated through experimental grooving tests using CBN tools on a CNC lathe. The experimental results show that as the depth of cut was increased there was a transition from ductile mode to brittle mode chip formation in grooving both with and without ultrasonic vibration assistance. However, the critical value of the depth of cut for ductile mode cutting with ultrasonic vibration assistance was much larger than that without ultrasonic vibration assistance. The ratio of the volume of removed material to the volume of the machined groove, f ab , was used to identify the ductile mode and brittle mode of chip formation in the grooving tests, in which f ab <1 indicates ductile mode chip formation and f ab >1 indicates brittle mode chip formation. For the same radius of tool cutting edge, the value of f ab at the ductile-brittle transition region either with or without ultrasonic vibration was less than 1. However, the f ab value with ultrasonic vibration assistance was close to 1. The experimental results demonstrate that ultrasonic vibration assisted cutting can be used to improve the ductile mode cutting performance of tungsten carbide work material.

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Literatur
1.
Zurück zum Zitat Liu K, Li XP (2001) Ductile cutting of tungsten carbide. J Mater Process Technol 113:348–354CrossRef Liu K, Li XP (2001) Ductile cutting of tungsten carbide. J Mater Process Technol 113:348–354CrossRef
2.
Zurück zum Zitat Liu K, Li XP (2001) Modeling of ductile cutting of tungsten carbide. In: Trans NAMRI/SME XXIX:251–258 Liu K, Li XP (2001) Modeling of ductile cutting of tungsten carbide. In: Trans NAMRI/SME XXIX:251–258
3.
Zurück zum Zitat Moriwaki T, Shamoto E, Inoue K (1992) Ultraprecision ductile cutting of glass by applying ultrasonic vibration. Ann CIRP 41:141–144 Moriwaki T, Shamoto E, Inoue K (1992) Ultraprecision ductile cutting of glass by applying ultrasonic vibration. Ann CIRP 41:141–144
4.
Zurück zum Zitat Blackley WS, Scattergood RO (1994) Chip topography for ductile-regime machining of germanium. Trans ASME J Eng Ind 116:263–266 Blackley WS, Scattergood RO (1994) Chip topography for ductile-regime machining of germanium. Trans ASME J Eng Ind 116:263–266
5.
Zurück zum Zitat Yan J, Yoshino M, Kuriagawa T, Shirakashi T, Syoji K, Komanduri R (2001) On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications. Mater Sci Eng A297:230–234 Yan J, Yoshino M, Kuriagawa T, Shirakashi T, Syoji K, Komanduri R (2001) On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications. Mater Sci Eng A297:230–234
6.
Zurück zum Zitat Fang FZ, Venkatesh VC (1998) Diamond cutting of silicon with nanometric finish. Ann CIRP 47:45–49 Fang FZ, Venkatesh VC (1998) Diamond cutting of silicon with nanometric finish. Ann CIRP 47:45–49
7.
Zurück zum Zitat Fang FZ, Chen LJ (2000) Ultra-precision cutting of ZKN7 glass. Ann CIRP 49:17–20 Fang FZ, Chen LJ (2000) Ultra-precision cutting of ZKN7 glass. Ann CIRP 49:17–20
8.
Zurück zum Zitat Kim JD, Choi IH (1997) Micro surface phenomenon of ductile cutting in the ultrasonic vibration cutting of optical plastics. J Mater Process Technol 68:89–98CrossRef Kim JD, Choi IH (1997) Micro surface phenomenon of ductile cutting in the ultrasonic vibration cutting of optical plastics. J Mater Process Technol 68:89–98CrossRef
9.
Zurück zum Zitat Kim JD, Choi IH (1998) Characteristics of chip generation by ultrasonic vibration cutting with extremely low cutting velocity. Int J Adv Manuf Technol 14:2–6 Kim JD, Choi IH (1998) Characteristics of chip generation by ultrasonic vibration cutting with extremely low cutting velocity. Int J Adv Manuf Technol 14:2–6
10.
Zurück zum Zitat Nerubai MS (1987) Characteristics of contact interaction in ultrasonic cutting of difficult-to-machine materials. Soviet J Frict Wear 8:452–458 Nerubai MS (1987) Characteristics of contact interaction in ultrasonic cutting of difficult-to-machine materials. Soviet J Frict Wear 8:452–458
11.
Zurück zum Zitat Lucas M, Graham G, Smith AC (1996) Enhanced vibration control of an ultrasonic cutting process. Ultrasonics 34:205–211CrossRef Lucas M, Graham G, Smith AC (1996) Enhanced vibration control of an ultrasonic cutting process. Ultrasonics 34:205–211CrossRef
12.
Zurück zum Zitat Astashev VK, Babitsky VI (1998) Ultrasonic cutting as a nonlinear (vibro-impact) process. Ultrasonics 36:89–96CrossRef Astashev VK, Babitsky VI (1998) Ultrasonic cutting as a nonlinear (vibro-impact) process. Ultrasonics 36:89–96CrossRef
13.
Zurück zum Zitat Moriwaki T, Shamoto E (1995) Ultrasonic elliptical vibration cutting. Ann CIRP 44:31–34 Moriwaki T, Shamoto E (1995) Ultrasonic elliptical vibration cutting. Ann CIRP 44:31–34
14.
Zurück zum Zitat Smith A, Nurse A, Graham G, Lucas M (1996) Ultrasonic cutting: a fracture mechanics model. Ultrasonics 34:197–203CrossRef Smith A, Nurse A, Graham G, Lucas M (1996) Ultrasonic cutting: a fracture mechanics model. Ultrasonics 34:197–203CrossRef
15.
Zurück zum Zitat Liu K, Li XP, Liang SY (2004) The mechanism of ductile chip formation in cutting of brittle materials. Adv Man Technol (in press) Liu K, Li XP, Liang SY (2004) The mechanism of ductile chip formation in cutting of brittle materials. Adv Man Technol (in press)
16.
Zurück zum Zitat Liu K, Li XP, Rahman M, Liu XD (2004) A study of the cutting in the grooving of tungsten carbide. Int J Adv Manuf Technol (in press) Liu K, Li XP, Rahman M, Liu XD (2004) A study of the cutting in the grooving of tungsten carbide. Int J Adv Manuf Technol (in press)
17.
Zurück zum Zitat Gahr ZKH (1987) Microstructure and wear of materials. Elsevier, Amsterdam Gahr ZKH (1987) Microstructure and wear of materials. Elsevier, Amsterdam
Metadaten
Titel
Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance
verfasst von
K. Liu
X. P. Li
M. Rahman
X. D. Liu
Publikationsdatum
01.09.2004
Verlag
Springer-Verlag
Erschienen in
The International Journal of Advanced Manufacturing Technology / Ausgabe 5-6/2004
Print ISSN: 0268-3768
Elektronische ISSN: 1433-3015
DOI
https://doi.org/10.1007/s00170-003-1647-5

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