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Microsystem Technologies

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01.07.2014 | Review Paper

Design principles and considerations for the ‘ideal’ silicon piezoresistive pressure sensor: a focused review

verfasst von: S. Santosh Kumar, B. D. Pant

Erschienen in: Microsystem Technologies | Ausgabe 7/2014

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Abstract

Over the past four decades, the field of silicon piezoresistive pressure sensors has undergone a major revolution in terms of design methodology and fabrication processes. Cutting edge fabrication technologies have resulted in improved precision in key factors like dimensions of diaphragm and placement of piezoresistors. Considering the unique nature of each sensor and the trade-offs in design, it is not feasible to follow a standard design approach. Thus, it is useful to derive the specific design from a number of important factors to arrive at the ‘ideal’ design. In this paper, we critically review and analyze the various design considerations and principles for silicon piezoresistive pressure sensor. We also report the effect of these considerations on the sensor output taking help of various CAD tools. Keeping in view the accuracy of state-of-the-art fabrication tools and the stringent demands of the present day market, it has become important to include many of these design aspects. Modelling using analytical expressions for thin plates has also been looked into as it gives a quick guideline and estimation of critical parameters before detailed finite element method analysis. Wherever possible, fabrication imperfections and their effects have been discussed. Dependency of piezoresistive coefficients on temperature and doping concentration, the effect of clamping condition of diaphragms and fabrication using wet bulk micromachining is also analyzed. Silicon-on-insulator based sensors along with innovative design strategies, and future trends have also been discussed. This paper will serve as a quick and comprehensive guide for pressure sensor developers.

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Titel: Design principles and considerations for the ‘ideal’ silicon piezoresistive pressure sensor: a focused review
verfasst von: S. Santosh Kumar
B. D. Pant
Publikationsdatum: 01.07.2014
Verlag: Springer Berlin Heidelberg
Erschienen in: Microsystem Technologies / Ausgabe 7/2014
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-014-2215-7

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Weitere Artikel der Ausgabe 7/2014

A new method for fast anodic bonding in microsystem technology

Vibration sensitivity analysis of the ‘Butterfly-gyro’ structure

Nonlinear behaviour of membrane type electromagnetic energy harvester under harmonic and random vibrations

Fabrication of high aspect ratio comb-drive actuator using deep X-ray lithography at Indus-2

Overview of microneedle system: a third generation transdermal drug delivery approach

Fabrication of a MEMS capacitive accelerometer with symmetrical double-sided serpentine beam-mass structure