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Erschienen in: Journal of Material Cycles and Waste Management 5/2021

21.07.2021 | ORIGINAL ARTICLE

Leaching of metals from printed circuit boards using ionic liquids

verfasst von: Yahaira Barrueto, Pía Hernández, Yecid Jiménez, Jaime Morales

Erschienen in: Journal of Material Cycles and Waste Management | Ausgabe 5/2021

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Abstract

The rise in the electronics industry has impacted the environment through the large volumes of waste that are improperly disposed of and the growing demand for precious and rare metals from natural sources. Leaching of copper, cobalt, gold, and silver from printed circuit boards of waste cellular phone has been carried out using imidazolium cation-based ionic liquids (ILs). For the studied metals, the obtaining of selective leaching obtained is reported for the first time, where acidic ionic liquids ([Bmim]HSO4 and [Hmim]HSO4) leached copper and cobalt, while basic ionic liquids ([Bmim]Cl and [Bmim]Br) extracted gold and silver. The effect of temperature has been studied by testing at 60 and 80 °C, where the highest extraction was obtained at the lowest temperature. The concentration of the ionic liquid was also studied through a test without ionic liquid and then varying from 20 to 60%, where at higher concentration the extraction is more efficient ratifying the use of ionic liquids as leaching solutions for metals. Ionic liquids have demonstrated the ability to leach metal ions as the primary reagent in the leaching solution. The following extraction percentages were obtained for each metal: 86.2% copper, 99.5% cobalt, 40.8% gold, and 44.6% silver.

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Metadaten
Titel
Leaching of metals from printed circuit boards using ionic liquids
verfasst von
Yahaira Barrueto
Pía Hernández
Yecid Jiménez
Jaime Morales
Publikationsdatum
21.07.2021
Verlag
Springer Japan
Erschienen in
Journal of Material Cycles and Waste Management / Ausgabe 5/2021
Print ISSN: 1438-4957
Elektronische ISSN: 1611-8227
DOI
https://doi.org/10.1007/s10163-021-01275-8

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