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Erschienen in:
01.02.2013
Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2013
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Abstract
Effects of two pre-treatment methods, isothermal annealing and DC-current stressing, on the reliability of solder interconnections under vibration loading has been studied in this paper. The results obtained show that: (1) isothermal annealing and DC-current stressing both compromise the reliability of interconnections during testing in comparison to the samples without pre-treatment and (2) the crack propagation path through the interconnection changes as compared to the samples without pre-treatments. The experimental results are rationalized with the help of detailed microstructural investigations coupled with the finite element method analysis. The DC-current stressing and isothermal annealing pre-treatments both soften the solder interconnections by inducing microstructural changes, which is reflected in the slightly reduced reliability under vibrational loading.