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Erschienen in: Journal of Materials Science: Materials in Electronics 2/2022

23.11.2021

Effect of TiO2 on the sintering temperature and dielectric properties of Li2O–MgO–ZnO–B2O3–SiO2 ceramic composites for LTCC applications

verfasst von: Huaizhi Wang, Yangfu Liu, Shaojin Luo, Guanyu Lu, Kainan Xie, Fan Yang, Jianxi Tong, Fancheng Meng

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2022

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Abstract

The effects of injecting TiO2 to a Li2O–MgO–ZnO–B2O3–SiO2 (LMZBS) microwave dielectric composite on sinterability, microstructure, crystalline phase, dielectric characteristics, mechanical characteristics, and coefficient of thermal expansion (CTE) were investigated. With the increase of TiO2 content, the main crystal orientation of the samples gradually changed from Li2MgSiO4 phase, Mg3B2O6 phase, and Mg2SiO4 phase to Li5.48Mg0.74Ti7.26O18, ZnTiO3 phase, and Mg2B2O5 and the densification temperature decreased, whisker-like crystal grains gradually increased, and the porous microstructure appeared at 15% TiO2. With the increase of TiO2 content, the densification temperature of LMZBS ceramics increases, and the dielectric constant increases with the increase of densification temperature. The CTE value decreases with the increase of titanium dioxide content, and the bending strength increases first and then decreases with the increase of titanium dioxide content. The composite with 10 wt% TiO2 content sintered at 900 °C exhibits superior performance: \({\varepsilon }_{\text{r}}\) of 7.97, Q value of 1305 (10 GHz), flexural strength of 259 MPa, CTE value of 10.2 ppm/°C, and \({\tau }_{\text{f}}\) value of − 13 ppm/°C. The LMZBS/TiO2 composites are suitable for LTCC application with match-well Ag electrodes.

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Metadaten
Titel
Effect of TiO2 on the sintering temperature and dielectric properties of Li2O–MgO–ZnO–B2O3–SiO2 ceramic composites for LTCC applications
verfasst von
Huaizhi Wang
Yangfu Liu
Shaojin Luo
Guanyu Lu
Kainan Xie
Fan Yang
Jianxi Tong
Fancheng Meng
Publikationsdatum
23.11.2021
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 2/2022
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-021-07370-8

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