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Journal of Materials Engineering and Performance
Erschienen in: Journal of Materials Engineering and Performance 9/2014

01.09.2014

Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength

verfasst von: Li-Ngee Ho, Hiroshi Nishikawa

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 9/2014

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Abstract

In this study, the effects of diethyl carbitol (diluent) and tertiary amines on the electrical, mechanical, and rheological properties of the Cu-filled polyurethane-based electrically conductive adhesives (ECAs) were investigated. Significant difference could be observed in the electrical resistivity and shear strength of ECA prepared with different amount of diethyl carbitol. Reduced electrical resistivity was found in ECAs prepared with addition of tertiary amines, but no obvious change was observed in the shear strength of the ECA joint. Rheological property of the ECA paste was investigated in order to understand the correlation of the viscosity of ECA paste and electrical resistivity and shear strength of ECA joint. Results revealed that decrease in viscosity of the ECA paste reduced electrical resistivity and enhanced shear strength of ECA joint. A Cu-filled polyurethane-based ECA with considerably low electrical resistivity at the magnitude order range of 10−3 Ω cm, and significantly high shear strength (above 17 MPa) could be achieved.
Vorheriger Artikel Effect of Laser Processing Parameters on the Formation of Intermetallic Compounds in Fe-Al Dissimilar Welding
Nächster Artikel Effect of Thermomechanical Processing on the Microstructure and Mechanical Properties of Nb-Ti-V Microalloyed Steel

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Metadaten
Titel
Copper-Filled Electrically Conductive Adhesives with Enhanced Shear Strength
verfasst von
Li-Ngee Ho
Hiroshi Nishikawa
Publikationsdatum
01.09.2014
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 9/2014
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-014-1115-4

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