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Erschienen in:
Nanomaterials for Microelectronic and Bio-packaging Kapitel lesen Erstes Kapitel lesen

2010 | OriginalPaper | Buchkapitel

On-Chip Thermal Management and Hot-Spot Remediation

verfasst von : Avram Bar-Cohen, Peng Wang

Erschienen in: Nano-Bio- Electronic, Photonic and MEMS Packaging

Verlag: Springer US

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Abstract

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in die heat flux and growing concern over the emergence of on-chip “hot spots.” The application of on-chip high heat flux cooling techniques provides a viable direction for the thermal management of such nanoelectronic components. Following a review of the relevant passive and active thermal management techniques, the physical phenomena underpinning the most promising on-chip thermal management approaches are described. Attention is devoted to thin-film and miniaturized thermoelectric coolers, orthotropic TIMs/heat spreaders, and phase-change microgap coolers for hot-spot remediation and thermal management of these nanoelectronic chips.

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Vorheriges Kapitel Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
Nächstes Kapitel Some Aspects of Microchannel Heat Transfer
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Metadaten
Titel
On-Chip Thermal Management and Hot-Spot Remediation
verfasst von
Avram Bar-Cohen
Peng Wang
Copyright-Jahr
2010
Verlag
Springer US
Buch
Nano-Bio- Electronic, Photonic and MEMS Packaging

Print ISBN: 978-1-4419-0039-5

Electronic ISBN: 978-1-4419-0040-1

Copyright-Jahr: 2010

DOI
https://doi.org/10.1007/978-1-4419-0040-1_12

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