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Erschienen in: Microsystem Technologies 1-2/2010

01.01.2010 | Technical Paper

Iteration method for analysis of write-current-induced thermal protrusion

verfasst von: Hui Li, Masayuki Kurita, Junguo Xu, Shinobu Yoshida

Erschienen in: Microsystem Technologies | Ausgabe 1-2/2010

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Abstract

This article presents a detailed iteration method for coupled air bearing and thermal-structure analysis, and introduces a node-to-node schematic for mapping the heat transfer coefficient into the thermal-structure analysis as boundary conditions. A three-dimensional finite element model is developed. The heat transfer coefficient on the air bearing surface of slider is calculated by a quasi-steady heat transfer model and applied to the thermal-structure analysis through the proposed node-to-node mapping schematic. The results show that the iteration process is indispensable for the air-bearing-thermal-structure analysis under high write power, but changeable under low write power. Among iterations, the values and distribution of the heat transfer coefficient vary significantly, especially around the protruding regions. The corresponding thermal protrusion induced by write current and its effects on flying attitude are different and the difference is increased with the heating power. For the application of high heating power and large thermal protrusion, at least a three-time iteration of the heat transfer coefficient is needed.

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Metadaten
Titel
Iteration method for analysis of write-current-induced thermal protrusion
verfasst von
Hui Li
Masayuki Kurita
Junguo Xu
Shinobu Yoshida
Publikationsdatum
01.01.2010
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 1-2/2010
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-009-0775-8

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