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Microsystem Technologies
Erschienen in: Microsystem Technologies 5/2017

04.03.2016 | Technical Paper

A thermal bonding method based on O2 plasma and water treatment for fabrication of PET planar nanofluidic device

verfasst von: Li Chen, Zhifu Yin, Helin Zou, Junshan Liu, Chong Liu, Kehong Li

Erschienen in: Microsystem Technologies | Ausgabe 5/2017

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Abstract

In this work, a thermal bonding method based on O2 plasma and water treatment was proposed to address the high dimension loss and low bonding strength issue during plastic planar nanofluidic device fabrication process. By this method, the PET (polyethylene terephthalate) planar nanofluidic device could be bonded at low temperature of 60 °C, force of 100 N and time of 15 min. To decrease the dimension loss and increase the bonding strength, thermal bonding parameters were optimized. The tensile test showed that the bonding strength of the PET planar nanofluidic device could be as high as 288.1 N. The fluorescence dye filling test indicated that there was no leakage and block in the PET planar nanofluidic device.
Vorheriger Artikel Fabrication of high aspect ratio self-aligned stepped polysilicon electrode for single-crystal silicon microstructure
Nächster Artikel Surface acoustic wave based pumping in a microchannel

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Metadaten
Titel
A thermal bonding method based on O2 plasma and water treatment for fabrication of PET planar nanofluidic device
verfasst von
Li Chen
Zhifu Yin
Helin Zou
Junshan Liu
Chong Liu
Kehong Li
Publikationsdatum
04.03.2016
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 5/2017
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-016-2897-0

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