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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 1/2014

01.01.2014

Microstructural characterization and mechanical properties of microplasma oxidized TiO2/Ti joints soldered using Sn3.5Ag4Ti(Ce) active filler

verfasst von: L. C. Tsao

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2014

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Abstract

In this study, a micro-porous titania (TiO2) layer was synthesized on commercial pure Ti using the microplasma oxidation (MPO) method. Ti/Ti, MPO-TiO2 (MPO-Ti)/Ti and MPO-Ti/MPO-Ti were successfully active soldered using this Sn3.5Ag4Ti(Ce) active filler metal at 250 °C for 60 s. The microstructure and mechanical properties of the active soldered joints were investigated. Results indicate that trace Ce reacts with the MPO-Ti layer to form both CeO2 and Ti, corresponding to the reaction between Ti and Sn to form Ti6Sn5, and nano-sizes Ag3Sn phases adsorb at the active filler/MPO-Ti interfaces. Shear strength of soldered Ti/Ti, MPO-Ti/Ti, and MPO-Ti/MPO-Ti specimens were measured to be 16.3 ± 1.39, 11.3 ± 1.56, and 9.5 ± 1.24 MPa, respectively. The fracture of Ti/Ti specimen was found to produce along the Ti2Sn3 and solder matrix. In the MPO-Ti/MPO-Ti specimen, the fractures occurred through the active filler/MPO-Ti interface. In the MPO-Ti/Ti specimen, the fracture failure mode transferred from MPO layer/Ti interfacial fracture to fracture within the active filler.
Vorheriger Artikel Influence of Fe dopant concentration and annealing temperature on the structural and optical properties of ZnO thin films deposited by sol–gel method
Nächster Artikel Influence of Ho substitution on structural, magnetic and microwave absorption properties of PbM-type hexaferrites nanoparticles

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Metadaten
Titel
Microstructural characterization and mechanical properties of microplasma oxidized TiO2/Ti joints soldered using Sn3.5Ag4Ti(Ce) active filler
verfasst von
L. C. Tsao
Publikationsdatum
01.01.2014
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1/2014
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-013-1577-4

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