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Erschienen in:
17.10.2015
Effect of cooling method and aging treatment on the microstructure and mechanical properties of Sn–10Bi solder alloy
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2016
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Abstract
The effects of cooling method and aging treatment on the microstructure and mechanical properties of Sn–10Bi solder alloy were investigated. The results showed that a kind of supersaturated β-Sn phase was found. More supersaturated β-Sn phase existed in Sn–10Bi solder alloy cooled in water and contributed to the higher ultimate tensile strength (about 83.8 MPa) compared with that cooled in air (about 63.6 MPa). After aged at 100 °C for 10 h, the Bi fraction of aged supersaturated β-Sn phase was lower than the un-aged. The Bi fraction of the aged Sn-rich phase was higher than the un-aged. The mechanical properties of aged Sn–10Bi solder alloy cooled in air were almost unchanged compared with the original one. However, the mechanical properties of Sn–10Bi solder alloy cooled in water were damaged greatly compared with the original one. It was contributed by the coarsened grain and the Bi phase segregation in the grain boundary during aging.