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Erschienen in: Journal of Materials Science: Materials in Electronics 23/2018

22.09.2018

Nanostructures confined self-assembled in biomimetic nanochannels for enhancing the sensitivity of biological molecules response

verfasst von: Qiao Chen, Yongqian Wang, Mingyan Zheng, Hao Fang, Xiang Meng

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 23/2018

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Abstract

The combination of biomimetic nanochannels and nanostructures provided a new idea for bioanalytical purposes. In this paper, we reported a self-assembled system based on the integration of anodic aluminum oxide (AAO) membranes and CuO method to fabricate CuO nanostructures in the confined area of AAO membranes. Furthermore, we investigated morphologies of the self-assembly systems by field emission scanning electron microscopy (FESEM) and characterized the type and content of microelements by energy dispersive spectrometer. Transmembrane ion current through nanochannels was tested by an electrochemical workstation, and optical properties of the self-assembly systems were characterized by ultraviolet–visible spectrophotometer. We could conclude from the results that the morphology and distribution status of CuO nanostructures are controllable, while ionic current through nanochannels and optical properties of self-assembled systems could be regulated by changing experimental parameters such as electrodeposition time, electrodeposition voltage or annealing temperature. On this base, we utilized the synergistic effect of nanochannels and nanostructures to enhance the sensitivity of biological molecules response. This study not only prepared CuO nanostructures in biomimetic nanochannels controllably, but also provided a novel application paradigm for nanochannels-nanostructures self-assembled system, which could be used for biological analysis and detection.

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Metadaten
Titel
Nanostructures confined self-assembled in biomimetic nanochannels for enhancing the sensitivity of biological molecules response
verfasst von
Qiao Chen
Yongqian Wang
Mingyan Zheng
Hao Fang
Xiang Meng
Publikationsdatum
22.09.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 23/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-0101-2

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