Microstructure and Impression Creep Characteristics of Cast Mg-5Sn-xBi Magnesium Alloys

The microstructure and creep behavior of a cast Mg-5Sn alloy with 1, 2, and 3 wt pct Bi additions were studied by impression tests in the temperature range 423 K to 523 K (150 °C to 250 °C) under punching stresses in the range 125 to 475 MPa for dwell times up to 3600 seconds. The alloy containing 3 wt pct Bi showed the lowest creep rates and, thus, the highest creep resistance among all materials tested. This is attributed to the favorable formation of the more thermally stable Mg₃Bi₂ intermetallic compound, the reduction in the volume fraction of the less stable Mg₂Sn phase, and the dissolution of Bi in the remaining Mg₂Sn particles. These particles strengthen both the matrix and grain boundaries during creep deformation of the investigated system. The creep behavior of the Mg-5Sn alloy can be divided into the low- and high-stress regimes, with the respective average stress exponents of 5.5 and 10.5 and activation energies of 98.3 and 163.5 kJ mol⁻¹. This is in contrast to the creep behavior of the Bi-containing alloys, which can be expressed by a single linear relationship over the whole stress and temperature ranges studied, yielding stress exponents in the range 7 to 8 and activation energies of 101.0 to 107.0 kJ mol⁻¹. Based on the obtained stress exponents and activation energies, it is proposed that the dominant creep mechanism in Mg-5Sn is pipe-diffusion controlled dislocation viscous glide the low-stress regime and dislocation climb creep with back stress in the high-stress regime. For the Mg-5Sn-xBi alloys, however, the controlling creep mechanism is dislocation climb with an additional particle strengthening effect, which is characterized by the higher stress exponent of 7 to 8.