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2020 | OriginalPaper | Buchkapitel

10. Managing Parameter Variations in Microsystems Device Design

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Abstract

The information covered from the previous chapters is brought together in this chapter to explain various techniques used in the microsystems design to manage the parameter variations resulting from use of microsystems manufacturing. Design for manufacturability (DfM) of microsystems is covered followed by some general recommendations for developing microsystems designs that adhere to DfM principles for MEMS devices. A review of the design techniques to manage device parameter variations is then provided including design centering: device parameter variation reduction; device size scaling; acceptance region increase; and best practices for layout. These techniques allow the variation region to be better aligned with the acceptance region. Each of these techniques is substantiated with examples in a one-dimensional parameter space, followed by how these techniques are used in multidimensional space. The use of Monte Carlo analysis techniques for design methods is then discussed including specific methods such as the centers of gravity algorithm; correlated sampling; and the common points method. The confidence of correct yield ranking is included in this discussion. Subsequently, sensitivity analysis for manufacturing or performance function improvement is outlined in both one- and multidimensional spaces. Lastly, a method for optimization of the manufacturing cost function is given.

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Fußnoten
1
The reader may wonder why the objective is not to maximize the yield. Sometimes obtaining maximum yield is the objective, but not always. In some situations, it may be beneficial to have a reduced, but satisfactory yield in order to lower the manufacturing costs.
 
2
In contrast an IC designer often does not have any freedom on the selection of the processing steps or process sequence.
 
3
Conventional semiconductor devices are more commonly represented by three layers including process; device; and circuit layers [6]. We show four layers, which is how the models are described for MEMS by Senturia [5].
 
4
Equation (10.3) is arguably too simplified as the defining equation for incompressible fluid flow in the microchannel since it ignores the regions of the flow path at the entrance and exits wherein the fluid flow is not well developed and also ignores the 90-degree turns that the fluid must make as it enters the inlet port and exits the outlet port. These effects would normally be included at the physical level since they will represent additional flow resistances. However, the inclusion of these effects greatly complicates the equations and, therefore, is not included in the example above.
 
5
The other sources of variations are the variations in material properties. However, as a general rule, the MEMS designer does not often have the ability to control the material properties, and even when control is possible, it usually will be only over a limited range of values as discussed in Chap. 6.
 
6
Material properties were discussed in Chap. 6.
 
7
The fluid viscosity is not like some material properties such as the Young’s modulus, due to the fact that the value of the viscosity is not process dependent.
 
8
It will be noticed that the normalized standard deviations in the table use the adjusted values of the device dimensional parameters to remove the bias variations.
 
9
It will be noticed that the normalized standard deviations in the table use the adjusted values of the device dimensional parameters to remove the bias variations.
 
10
The microchannel example of the previous section could have been presented this way since there are two important parameters as well, but to simplify the discussion, the parameters were examined separately. It is also important to note that altering the nominal values can result in a change in the tolerances and the boundaries of the region of variation.
 
11
The goal may be more complicated, such as maximizing the yield within certain cost constraints. Nevertheless, these considerations can be taken into account during the design process.
 
12
In MEMS microsystems manufacturing, the relationship between cost and parameter variations is usually more complicated than shown in Fig. 10.39. The actual relationship often more resembles a descending staircase wherein the variations using a specific set of fabrication equipment have a relatively fixed cost over a range of parameter variations values that increase or decrease with the use of other sets of fabrication equipment having higher or lower resolution.
 
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Metadaten
Titel
Managing Parameter Variations in Microsystems Device Design
verfasst von
Michael Huff
Copyright-Jahr
2020
DOI
https://doi.org/10.1007/978-3-030-40560-1_10