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Erschienen in:
Introduction to Nanotechnology Kapitel lesen Erstes Kapitel lesen

2007 | OriginalPaper | Buchkapitel

10. Material Aspects of Micro- and Nanoelectromechanical Systems

verfasst von : Christian Zorman, Prof., Mehran Mehregany, Prof.

Erschienen in: Springer Handbook of Nanotechnology

Verlag: Springer Berlin Heidelberg

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Abstract

One of the more significant technological achievements during the last 20 years has been the development of MEMS and its new offshoot, NEMS. These developments were made possible by significant advancements in the materials and processing technologies used in the fabrication of MEMS and NEMS devices. While initial developments capitalized on a mature Si infrastructure built for the integrated circuit (IC) industry, recent advances have come about using materials and processes not associated with IC fabrication, a trend that is likely to continue as new application areas emerge.
A well-rounded understanding of MEMS and NEMS technology requires a basic knowledge of the materials used to construct the devices, since material properties often govern device performance and dictate fabrication approaches. An understanding of the materials used in MEMS and NEMS involves an understanding of material systems, since such devices are rarely constructed of a single material but rather a collection of materials working in conjunction with each other to provide critical functions. It is from this perspective that the following chapter is constructed. A preview of the materials selected for inclusion in this chapter is presented in Table 10.1. It should be clear from this table that this chapter is not a summary of all materials used in MEMS and NEMS, as such a work would itself constitute a text of significant size. It does, however, present a selection of some of the more important material systems, and especially those that illustrate the importance of viewing MEMS and NEMS in terms of material systems.
Table 10.1
Distinguishing characteristics and application examples of selected materials for MEMS and NEMS
Material
Distinguishing characteristics
Application examples
Single-crystal silicon (Si)
High-quality electronic material, selective anisotropic etching
Bulk micromachining, piezoresistive sensing
Polycrystalline Si (polysilicon)
Doped Si films on sacrificial layers
Surface micromachining, electrostatic actuation
Silicon dioxide (SiO2)
Insulating, etched by HF, compatible with polysilicon
Sacrificial layer in polysilicon surface micromachining, passivation layer for devices
Silicon nitride (Si3N4, Si x N y )
Insulating, chemically resistant, mechanically durable
Isolation layer for electrostatic devices, membrane and bridge material
Polycrystalline germanium (polyGe), Polycrystalline silicon-germanium (poly Si–Ge)
Deposited at low temperatures
Integrated surface micromachined MEMS
Gold (Au), aluminum (Al)
Conductive thin films, flexible deposition techniques
Innerconnect layers, masking layers, electromechanical switches
Bulk ti
High strength, corrosion resistant
Optical MEMS
Nickel-iron (NiFe)
Magnetic alloy
Magnetic actuation
Titanium-nickel (TiNi)
Shape-memory alloy
Thermal actuation
Silicon carbide (SiC) diamond
Electrically and mechanically stable at high temperatures, chemically inert, high Young's modulus to density ratio
Harsh-environment MEMS, high-frequency MEMS/NEMS
Gallium arsenide (GaAs), indium phosphide (InP), indium arsenide (InAs) and related materials
Wide bandgap, epitaxial growth on related ternary compounds
RF MEMS, optoelectronic devices, single-crystal bulk and surface micromachining
Lead zirconate titanate (PZT)
Piezoelectric material
Mechanical sensors and actuators
Polyimide
Chemically resistant, high-temperature polymer
Mechanically flexible MEMS, BioMEMS
SU-8
Thick, photodefinable resist
Micromolding, High-aspect-ratio structures
Parylene
Biocompatible polymer, deposited at room temperature by CVD
Protective coatings, molded polymer structures
Liquid crystal polymer
Chemically resistant, low moisture permeability, insulating
BioMEMS, RF MEMS

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Vorheriges Kapitel Stamping Techniques for Micro- and Nanofabrication
Nächstes Kapitel Complexity and Emergence as Design Principles for Engineering Decentralized Nanoscale Systems
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Metadaten
Titel
Material Aspects of Micro- and Nanoelectromechanical Systems
verfasst von
Christian Zorman, Prof.
Mehran Mehregany, Prof.
Copyright-Jahr
2007
Verlag
Springer Berlin Heidelberg
Buch
Springer Handbook of Nanotechnology

Print ISBN: 978-3-540-29855-7

Electronic ISBN: 978-3-540-29857-1

Copyright-Jahr: 2007

DOI
https://doi.org/10.1007/978-3-540-29857-1_10

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