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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 6/2020

11.02.2020 | Review

Metal oxide nanofluids in electronic cooling: a review

verfasst von: D. S. Saidina, M. Z. Abdullah, M. Hussin

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2020

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Abstract

Loop heat pipe (LHP) has gained significant interest, particularly in the field of cooling electronics, and has been considered as an efficient heat transfer device in today’s electronic technologies. LHP is preferred over conventional heat pipes (HP) due to the high efficiency, high heat flux capability, ability to transfer energy over long distances and ability to operate over a range of environments. Brief comparisons between HP and LHP for electronic cooling are discussed. For the past 10 years, numerous studies have reported on the synthesis of nanofluids used in LHP for cooling electronics. Nanofluids have been widely used in electronic applications due to their superior heat transfer and thermal properties. The nanofluid fabrication, stability and surfactants are reviewed. Recent works on metal oxide nanofluids and properties that influence the thermophysical properties of nanofluids, such as thermal conductivity, viscosity and surface tension, are also reported. Another intention behind this review is to explain the challenges of metal oxide nanofluids in electronics cooling.
Nächster Artikel Analysis on the synthesis of vertically aligned carbon nanotubes: growth mechanism and techniques

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Metadaten
Titel
Metal oxide nanofluids in electronic cooling: a review
verfasst von
D. S. Saidina
M. Z. Abdullah
M. Hussin
Publikationsdatum
11.02.2020
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 6/2020
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-03020-7

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