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2020 | OriginalPaper | Buchkapitel

Microstructure and Tensile Properties of a CoNi-Based Superalloy Fabricated by Selective Electron Beam Melting

verfasst von : Sean P. Murray, Kira M. Pusch, Andrew T. Polonsky, Chris J. Torbet, Gareth G. E. Seward, Peeyush Nandwana, Michael M. Kirka, Ryan R. Dehoff, Ning Zhou, Stéphane A. J. Forsik, William Slye, Tresa M. Pollock

Erschienen in: Superalloys 2020

Verlag: Springer International Publishing

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Abstract

Successful application of selective electron beam melting to a novel CoNi-based superalloy named SB-CoNi-10 is demonstrated. Crack-free as-printed microstructures exhibit excellent ductilities above 30% and ultimate tensile strengths above 1.1 GPa at room temperature in tension. Conventional post-processing consisting of a super-solvus hot isostatic pressing (HIP), a solution heat treatment (SHT), and a low-temperature aging has been applied to remove microstructural inhomogeneities present in the as-printed microstructure. The microstructures of the as-printed and HIP+SHT+Aged alloys have been investigated to determine the effect of post-processing heat treatments on the nanoscale \(\gamma \)/\(\gamma ^{\prime }\) microstructure and the mesoscale grain structure. Tensile tests have been conducted at room temperature and elevated temperatures above 850 \(^{\circ }\)C to investigate mechanical properties in both the as-printed and HIP+SHT+Aged conditions. The high-temperature ductility and strength are strongly affected by the microstructure, with a mostly columnar-grained microstructure in the as-printed condition exhibiting superior ductility to the fully recrystallized microstructure in the HIP+SHT+Aged condition.

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Fußnoten
1
CM 247\(^\circledR \) is a registered trademark of the Cannon-Muskegon Corporation.
 
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Metadaten
Titel
Microstructure and Tensile Properties of a CoNi-Based Superalloy Fabricated by Selective Electron Beam Melting
verfasst von
Sean P. Murray
Kira M. Pusch
Andrew T. Polonsky
Chris J. Torbet
Gareth G. E. Seward
Peeyush Nandwana
Michael M. Kirka
Ryan R. Dehoff
Ning Zhou
Stéphane A. J. Forsik
William Slye
Tresa M. Pollock
Copyright-Jahr
2020
DOI
https://doi.org/10.1007/978-3-030-51834-9_86

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