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Journal of Materials Engineering and Performance
Erschienen in: Journal of Materials Engineering and Performance 3/2014

01.03.2014

Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites

verfasst von: Y. Kan, Z. G. Liu, S. H. Zhang, L. W. Zhang, M. Cheng, H. W. Song

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 3/2014

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Abstract

Modeling and prediction of the damage evolution in particle reinforced composites is a complex problem. Microstructure characters such as the particle morphologies, sizes, and distribution significantly affect the damage evolution in composites. A numerical simulation has been performed to investigate the damage evolution of SiCp/AA2009 composites. Tensile deformation in SiCp/AA2009 composites was simulated using the microstructure-based model constructed from the metallograph. Matrix damage, particle cracking, and interface debonding were simulated combining the ductile damage model, the normal stress criterion, and the maximum stress ratio criterion. The simulation results show that under tensile loading, damage initiates at the interface, and then propagates along the weakest direction. The simulation microstructures agree well with experimental results in which interface debonding, particle cracking, and matrix damage co-exist. In addition, the effects of component properties on the damage evolution are examined for various situations.
Vorheriger Artikel Constitutive Modeling of Dynamic Recrystallization Behavior and Processing Map of 38MnVS6 Non-Quenched Steel
Nächster Artikel Modeling the High Temperature Flow Behavior and Dynamic Recrystallization Kinetics of a Medium Carbon Microalloyed Steel

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Metadaten
Titel
Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites
verfasst von
Y. Kan
Z. G. Liu
S. H. Zhang
L. W. Zhang
M. Cheng
H. W. Song
Publikationsdatum
01.03.2014
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 3/2014
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-013-0805-7

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