Skip to main content
Fachgebiete
Automobil + Motoren Bauwesen + Immobilien Business IT + Informatik Elektrotechnik + Elektronik Energie + Nachhaltigkeit Finance + Banking Management + Führung Marketing + Vertrieb Maschinenbau + Werkstoffe Versicherung + Risiko
DE
EN
Bücher
Zeitschriften
Themenseiten
Organisationspsychologie Projektmanagement Marketing Smart Manufacturing
Weitere Formate
Podcasts Webinare Technik Webinare Wirtschaft Kongresse Veranstaltungskalender Awards
Jetzt Einzelzugang starten
Zugang für Unternehmen
Referenzkunden
SLX-Digitalkonferenz: Zukunftswerkstatt 2024

Mehr Umsatz mit Top-Kontakten

Am 7. Mai erfahren Sie, wie Vertriebsteams Leadgenerierung, Leadnurturing und Leadstrategien effizient steuern können.
Erweiterte Suche
Anmelden
nach oben
Erschienen in:
Buchtitelbild

2018 | OriginalPaper | Buchkapitel

1. Overview of MEMS Packaging Technologies

verfasst von : Seonho Seok

Erschienen in: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Verlag: Springer International Publishing

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

Packaging for MEMS (microelectromechanical systems) is attracting increased interest because it is being recognized as an essential technique for successful commercialization of MEMS product. Similar to integrated circuit (IC) packaging in microelectronics, packaging of MEMS bears the highest cost within the whole manufacturing processes.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Jetzt informieren
Nächstes Kapitel Microcap (or Microstructure) Transfer Techniques
Literatur
1.
M. Esashi, Wafer level packaging of MEMS. J. Micromech. Microeng. 18, 073001 (2008)CrossRef
2.
R.W. Bower, M.S. Ismail, B.E. Roberds, Low temperature Si3N4 direct bonding. Appl. Phys. Lett. 62, 3485–3487 (1993)CrossRef
3.
H. Takagi, R. Maeda, T.R. Chung, T. Suga, Low temperature direct bonding of silicon and silicon dioxide by the surface activation method. Int. Conf. Solid-State Sens. Actuators, Transducer 97(1), 657–660 (1997)CrossRef
4.
B. Lee, S. Seok, K. Chun, A study on wafer level vacuum packaging for MEMS devices. J. Micromech. Microeng. 13(5), 663–669 (2003)CrossRef
5.
S. Tanaka, Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues. Microelectron. Reliab. 54(5), 875–881 (2014)CrossRef
6.
S. Lemettre, S. Seok, N. Isac, J. Moulin, A. Bosseboeuf, Low temperature solid-liquid interdiffusion wafer and die bonding based on PVD thin Sn/Cu films. Microsyst. Technol. (2016)
7.
S. Seok, M. Fryziel, N. Rolland, P.-A. Rolland, Enhancement of bonding strength of packaging based on BCB bonding for RF devices. Microsyst. Technol. 18(12), 2035–2039 (2012)CrossRef
8.
H.C. Kim, S. Seok, I. Kim, S.-D. Choi, K. Chun, in Transducers’05, Seoul, Korea. Inertial-Grade Out-of-Plane and In-Plane Differential Resonant Silicon Accelerometers (DRXLs) (2005), pp. 172–179
9.
S. Seok, K. Chun, An inertial-grade in-plane resonant silicon accelerometer. Electron. Lett. 42(19), 755–757 (2006)CrossRef
10.
I. Kim, S. Seok, H.C. Kim, M.K. Kang, K. Chun, Wafer level vacuum packaged out-of-plane and in-plane differential resonant silicon accelerometers for navigational applications. J. Semicond. Technol. Sci. (JSTS) 5(1), 58–66 (2005)
11.
S. Tanaka, H. Fukushi, in Transducers 2015, Anchorage, Alaska, USA. Comprehensive study on Wafer-Level Vacuum Packaging Using Anodically-Bondable LTCC Wafer and Thin Film Getter (2015), pp. 468–471
12.
S. Tanaka, S. Matsuzaki, M. Mohri, A. Okada, H. Fukushi, M. Esashi, in 24th IEEE International Conference on Micro ElectroMechanical Systems (MEMS 2011), Cancun, Mexico. Wafer-Level Hermetic Packaging Technology for MEMS Using Anodically-Bondable LTCC Wafer (2011), pp. 376–379
13.
K. Stamoulis, C.H. Tsau, S. Mark Spearing, in Proceedings of the SPIE. Low-Temperature Wafer-Level Gold Thermocompression Bonding: Modeling of Flatness Deviations and Associated Process Optimization for High Yield and Tough Bonds, vol. 5716, (2005), pp. 42–52
14.
M.M. Torunbalci, S.E. Alper, T. Akin, Advanced MEMS process for wafer level hermetic encapsulation of MEMS devices using SOI cap wafers with vertical Feedthroughs. J. Microelectromechan. Syst. 24(3), 556–564 (2015)CrossRef
15.
W.C. Welch III, Vacuum and hermetic packaging of MEMS using solder. Ph.D. dissertation, University of Michigan, Ann Arbor, MI, USA, 2008
16.
Y.T. Cheng, L. Lin, K. Najafi, Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging. J. Microelectomech. Syst. 9(1), 3–8 (2000)CrossRef
17.
L. Lin, MEMS post-packaging by localized heating and bonding. IEEE Trans. Adv. Packag. 23(4), 608–616 (2000)CrossRef
18.
R.N. Candler, M.A. Hopcroft, B. Kim, W.-T. Park, R. Melamud, M. Agarwal, G. Yama, A. Partridge, M. Lutz, T.W. Kenny, Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators. J. Microelectomech. Syst. 15(6), 1446–1456 (2006)CrossRef
19.
F. Santagata, J.J.M. Zaal, V.G. Huerta, L. Mele, J.F. Creemer, P.M. Sarro, Mechanical design and characterization for MEMS thin-film packaging. J. Microelectromech. Syst. 21(1), 100–109 (2012)CrossRef
20.
J. Zekry, D.S. Tezcan, J.-P. Celis, R. Puers, C. Van Hoof, H.A.C. Tilmans, in Proceedings of 16th International Solid-State Sensors Actuators Microsystems Conference (Transducers). Wafer-Level Thin Film Vacuum Packages for MEMS Using Nanoporous Anodic Alumina Membranes (2011), pp. 974–977
21.
B.-K. Lee, D.-H. Choi, J.-B. Yoon, Use of nanoporous columnar thin film in the wafer-level packaging of MEMS devices. J. Micromech. Microeng. 20, 045002 (2010)CrossRef
22.
E.S. Park, J. Jeon, V. Subramanian, T.-J. King Liu, in MEMS 2012, Paris, France. Inkjet-printed microshell encapsulation: a new zero-level packaging technology, 29 Jan–2 Feb 2012, pp. 357–360
23.
D.I. Forehand, C.L. Goldsmith, in 2005 ASME InterPACK ‘05 Tech Conference, San Francisco, CA. Wafer Level Micropackaging for RF MEMS Switches (2005)
24.
I. Zine-El-Abidine, M. Okoniewski, A low-temperature SU-8 based wafer-level hermetic packaging for MEMS devices. IEEE Trans. Adv. Packag. 32(2), 448–452 (2009)CrossRef
25.
E. Uzunlar, P.A. Kohl, Size-compatible, polymer-based air-gap formation processes, and polymer residue analysis for wafer-level MEMS packaging applications. J. Electron. Packag 137, 041001-1 (2015)CrossRef
26.
P. Monajemi, P.J. Joseph, P.A. Kohl, F. Ayazi, Wafer-level MEMS packaging via thermally released metal-organic membranes. J. Micromech. Microeng. 16(4), 742–750 (2006)CrossRef
27.
M.B. Cohn, R.T. Howe, Wafer-to-Wafer Transfer of Microstructures Using Break-Away Tethers, US Patent 6,142,358, 2000
28.
J.-Y. Chen, L.-S. Huang, C.-H. Chu, C. Peizen, A new transferred ultra-thin silicon micropackaging. J. Micromech. Microeng. 12, 406–409 (2002)CrossRef
29.
W.C. Welch III, J. Chae, K. Najafi, Transfer of metal MEMS packages using a wafer-level solder transfer technique. IEEE Trans. Adv. Packag. 28(4), 643–649 (2005)CrossRef
30.
S. Tanaka, M. Yoshida, H. Hirano, T. Somekawa, M. Fujita, M. Esashi, in IEEE MEMS 2013, Taipei. Wafer-to-Wafer Selective Flip-Chip Transfer by Sticky Silicone Bonding and Laser Debonding for Rapid and Easy Integration Test, 20–24 Jan 2003, pp. 271–274
31.
S. Tanaka, M. Yoshida, H. Hirano, M. Esashi, Lithium niobate SAW device hetero-transferred onto silicon integrated circuit using elastic and sticky bumps. IEEE international ultrasonics symposium, Dresden, Germany, 7–10 Oct 2012, pp. 1047–1050
32.
S. Seok, N. Rolland, P.-A. Rolland, Packaging methodology for RF devices using a BCB membrane transfer technique. J. Micromech. Microeng. 16(11), 2384–2388 (2006)CrossRef
33.
J. Kim, S. Seok, N. Rolland, Polymer-based zero-level packaging technology for high frequency RF applications by wafer bonding/debonding technique using an anti-adhesion layer. Int. J. Precis. Eng. Manuf. (IJPEM) 13(10), 1861–1867 (2012)CrossRef
34.
S. Seok, Fabrication and modeling of nitride thin film encapsulation based on anti-adhesion-assisted transfer technique and nitride/BCB bilayer wrinkling. IEEE Trans. Compon. Packag. Manuf. Technol. (CPMT) 6(9), 1301–1307 (2016)CrossRef
Metadaten
Titel
Overview of MEMS Packaging Technologies
verfasst von
Seonho Seok
Copyright-Jahr
2018
Buch
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Print ISBN: 978-3-319-77871-6

Electronic ISBN: 978-3-319-77872-3

Copyright-Jahr: 2018

DOI
https://doi.org/10.1007/978-3-319-77872-3_1

Premium Partner

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Zur Marktübersicht
    Bildnachweise