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Erschienen in:
2010 | OriginalPaper | Buchkapitel
Power delivery, signaling and cooling for 2D and 3D integrated systems
verfasst von : Dr. Muhannad Bakir, Gang Huang, Bing Dang
Erschienen in: Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Verlag: Springer US
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As gigascale integrated (GSI) technology progresses beyond the 45 nm generation, the performance of a monolithic system-on-a-chip (SoC) has failed by progressively greater margins to reach the “intrinsic limits” of each particular generation of technology [1]. The root cause of this lag is the fact that the capabilities of monolithic silicon technology per se have vastly surpassed those of the ancillary or supporting technologies that are essential to the full exploitation of a high-performance SoC. The most serious obstacle that blocks fulfillment of the ultimate performance of an SoC is inferior heat removal.