2010 | OriginalPaper | Buchkapitel
Capacitive Coupled Communication
verfasst von : David Hopkins, Alex Chow, Dr. Frankie Liu, Dr. Dinesh D. Patil, Dr. Hans Eberle
Erschienen in: Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Verlag: Springer US
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Capacitive coupled communication is a wireless chip to chip communication technology that uses capacitive coupling to transfer signals from a chip to neighboring chips. Its high-bandwidth, low-power, and low-latency chip-to-chip I/O capabilities enable the construction of high-performance and economical multi-chip modules (MCMs). Chips are placed face-to-face (Figure 1), with only a few microns of separation, such that overlapping transceiver circuits communicate through capacitive coupling between top-layer metal pads [1]. By using relatively small metal structures to communicate signals over short distances, capacitive coupled communication directly improves channel density, power, and latency to more closely match the performance of on-chip wires.