Anzeige
Erschienen in:
01.05.2011
Preparation and properties of siloxane polyimide films containing silver nanoparticles and microparticles as conducting adhesive films
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 5/2011
EinloggenAktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
Abstract
Electrically conducting adhesive films containing silver nanosized particles (AgNPs) were prepared using siloxane polyimide resin (SPI), and their physical properties were investigated. AgNPs with diameters of ca. 6 nm were prepared using oleylamine as a stabilizer. A mixture of the AgNPs and SPI was vigorously stirred, and cast on a polyethylene terephthalate support. Films were then fabricated using a doctor blade method. The heat resistance of the SPI film containing 60 wt% AgNPs was 35 °C higher than that of the SPI film without AgNPs. In addition, epoxy composite SPIAg (Epo-SPIAg) films containing a mixture of AgNPs and micro-sized silver flakes were prepared. Inclusion of AgNPs in these films strengthened their adhesion to silicon or bismaleimide triazine resin substrates. The glass transition temperature of the Epo-SPIAg films containing AgNPs was slightly higher than that of the film containing only micro-sized silver flakes.