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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 4/2019

23.01.2019

Preparation of microwave absorbing Co-C nanofibers with robust superhydrophobic properties by electrospinning

verfasst von: Yongqian Shen, Yupeng Wei, Jian Li, Qinglin Li, Jiqiang Ma, Pingbo Wang, Bin Li, Wenbo He, Xueyan Du

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 4/2019

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Abstract

High-performance microwave absorbers with excellent absorption ability and superhydrophobic property are extremely significant for the application of stealthy techniques, especially in high-humidity environment. In this research, high-performance Co-C nanofibers (NFs) were prepared via electrospinning mathod by using of poly (vinyl alcohol) (PVA) and Cobalt acetate tetrahydrate (CoAc) solution as precursor with subsequent PVA pyrolyzation and carbonization process. The electromagnetic (EM) parameters and microwave absorption performance of the prepared NFs were investigated with the microwave frequency ranging from 2.0 GHz to 18.0 GHz. Analysis and comparison were performed on the impedance matching and loss mechanisms of each sample. The experimental results indicated that the sample calcinated at 950 °C achieved an optimal reflection loss (RL) of − 33.1 dB and an effective frequency bandwidth of 4.1 GHz under a thickness of 1.5 mm; and that the Co-C NFs membrane with the optimal absorption performance exhibited superhydrophobic property with a contact angle (CA) of 152°, suggesting their promising application to water-resistant stealthy materials.
Vorheriger Artikel Microwave absorption properties of SiO2 doped furan resin derived carbon particles
Nächster Artikel Structurally modulated dielectric relaxation in rhombohedral Cr2O3 mediated by Mn addition

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Metadaten
Titel
Preparation of microwave absorbing Co-C nanofibers with robust superhydrophobic properties by electrospinning
verfasst von
Yongqian Shen
Yupeng Wei
Jian Li
Qinglin Li
Jiqiang Ma
Pingbo Wang
Bin Li
Wenbo He
Xueyan Du
Publikationsdatum
23.01.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 4/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-00610-4

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