Research on an improved bath cooling and lubrication method for diamond wire sawing

The silicon slicing efficiency and quality of silicon wafer seriously affect the cost of solar power generation and the development of photovoltaic energy industry. This paper proposed an improved cooling and lubrication method using a water tank bath for diamond wire sawing. Compared with the traditional jet sawing with array nozzles, it can be found that the surface roughness is better, no matter the average roughness value, the skewness coefficient, or the kurtosis coefficient, especially in high production efficiency processing. Similar conclusions can also be obtained from the comparative analysis of surface profile distribution and SEM micrographs. This is because the bath sawing can make full use of the cooling and lubricating capability of the cutting fluid, so that the diamond wire can achieve better fluid-carrying effect with the same directionality as the sawing direction into the cutting zone. Furthermore, the service life of diamond wire in bath sawing is longer and wire consumption is lower.