Skip to main content
Erschienen in: Journal of Materials Engineering and Performance 6/2008

01.12.2008

Research on Transient Liquid Phase Diffusion Bonding of Steel Sandwich Panels Under Small Plastic Deformation

verfasst von: H. Li, Z. X. Li

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 6/2008

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

Plastic deformation was newly introduced in transient liquid phase (TLP) diffusion bonding of steel sandwich panels. The effect of plastic deformation on bonding strength was investigated through lab experiments. It was assumed that three factors, including newly generated metal surface area, deformation heat, and lattice distortion, contribute to the acceleration of interface atoms diffusion and increase of diffusion coefficients. A numerical model of isothermal solidification time was developed for TLP bonding process under plastic deformation and applied to carbon steel sandwich panels bonding with copper interlayer. A reasonable isothermal solidification time was obtained when an effective diffusion coefficient was used. Based on lab experiments, the effects of plastic deformation on interlayer film thickness and isothermal solidification time were studied through theoretical calculation with the new model. The evolution of interlayer film thickness indicates a good agreement between the calculation and experimental measurement. The results show that the isothermal solidification time is obviously reduced due to the effect of plastic deformation. Furthermore, a new steel sandwich cooling panel for heat exchanger was fabricated by TLP diffusion bonding under 13.1% plastic deformation. The test results suggest that a steel sandwich panel of inequidistant fin structure can provide enhanced heat transfer efficiency.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat W.F. Gale, D.A. Butts, Overview Transient Liquid Phase Bonding, Sci. Technol. Weld. Joining, 2004, 9, p 283–300CrossRef W.F. Gale, D.A. Butts, Overview Transient Liquid Phase Bonding, Sci. Technol. Weld. Joining, 2004, 9, p 283–300CrossRef
2.
Zurück zum Zitat J.D. Sugar, J.T. Mckeown, T. Akashi, S.M. Hong, K. Nakashima, A.M. Glaeser, Transient-Liquid-Phase and Liquid-Film-Assisted Joining of Ceramics, J. Euro. Cera. Soc., 2006, 26, p 363–371CrossRef J.D. Sugar, J.T. Mckeown, T. Akashi, S.M. Hong, K. Nakashima, A.M. Glaeser, Transient-Liquid-Phase and Liquid-Film-Assisted Joining of Ceramics, J. Euro. Cera. Soc., 2006, 26, p 363–371CrossRef
3.
Zurück zum Zitat M.D. Tuah-Poku and T.B. Massaliski, A Study of the Transient Liquid Phase Bonding Process Applied to a Ag/Cu/Ag Sandwich Joint, Metall. Trans. A, 1988, 19, p 675–686CrossRef M.D. Tuah-Poku and T.B. Massaliski, A Study of the Transient Liquid Phase Bonding Process Applied to a Ag/Cu/Ag Sandwich Joint, Metall. Trans. A, 1988, 19, p 675–686CrossRef
4.
Zurück zum Zitat R.K. Bird, E.K. Hoffman, NASA Report L-17717. NASA, Washington DC, 1998, p 26 R.K. Bird, E.K. Hoffman, NASA Report L-17717. NASA, Washington DC, 1998, p 26
5.
Zurück zum Zitat N.L.R. Ojo and M.C. Chaturvedi, Effect of Gap Size and Process Parameters on Diffusion Brazing of Inconel 738, Sci. Technol. Weld. Joining, 2004, 9, p 532–540CrossRef N.L.R. Ojo and M.C. Chaturvedi, Effect of Gap Size and Process Parameters on Diffusion Brazing of Inconel 738, Sci. Technol. Weld. Joining, 2004, 9, p 532–540CrossRef
6.
Zurück zum Zitat M.A. Arafin, M. Medraj, D.P. Turner, P. Bocher, Transient Liquid Phase Bonding of Inconel 718 and Inconel 625 with BNi-2: Modeling and Experimental Investigations, Mater. Sci. Eng. A, 2007, 447, p 125–133CrossRef M.A. Arafin, M. Medraj, D.P. Turner, P. Bocher, Transient Liquid Phase Bonding of Inconel 718 and Inconel 625 with BNi-2: Modeling and Experimental Investigations, Mater. Sci. Eng. A, 2007, 447, p 125–133CrossRef
7.
Zurück zum Zitat Y. Natsume, K. Ohsasa, T. Narita, Numerical Modeling of the Transient Liquid-Phase Diffusion Bonding Process of Al Using Cu Filler Metal, ISIJ Int., 2003, 12, p 1976–1982CrossRef Y. Natsume, K. Ohsasa, T. Narita, Numerical Modeling of the Transient Liquid-Phase Diffusion Bonding Process of Al Using Cu Filler Metal, ISIJ Int., 2003, 12, p 1976–1982CrossRef
8.
Zurück zum Zitat Y. Zhou, W.F. Gale, T.H. North, Modelling of Transient Liquid Phase Bonding, Int. Mater. Rev., 1995, 40, p 181–196CrossRef Y. Zhou, W.F. Gale, T.H. North, Modelling of Transient Liquid Phase Bonding, Int. Mater. Rev., 1995, 40, p 181–196CrossRef
9.
Zurück zum Zitat W.D. MacDonald, T.W. Eagar, Isothermal Solidification Kinetics of Diffusion Brazing, Metall. Mater. Trans. A, 1996, 29, p 315–325CrossRef W.D. MacDonald, T.W. Eagar, Isothermal Solidification Kinetics of Diffusion Brazing, Metall. Mater. Trans. A, 1996, 29, p 315–325CrossRef
10.
Zurück zum Zitat C.E. Campbell, W.J. Boettinger, Transient Liquid-Phase Bonding in the Ni-Al-B System, Metall. Trans. A, 2000, 31, p. 2835–2842CrossRef C.E. Campbell, W.J. Boettinger, Transient Liquid-Phase Bonding in the Ni-Al-B System, Metall. Trans. A, 2000, 31, p. 2835–2842CrossRef
11.
Zurück zum Zitat T. Padron, T.I. Khan, M.J. Kabir, Modelling the Transient Liquid Phase Bonding Behaviour of a Duplex Stainless Steel Using Copper Interlayer, Mater. Sci. Eng. A, 2004, 385, p. 220–228CrossRef T. Padron, T.I. Khan, M.J. Kabir, Modelling the Transient Liquid Phase Bonding Behaviour of a Duplex Stainless Steel Using Copper Interlayer, Mater. Sci. Eng. A, 2004, 385, p. 220–228CrossRef
12.
Zurück zum Zitat T.C. Illingworth, I.O. Golosnoy, T.W. Clyne, Modelling of Transient Liquid Phase Bonding in Binary Systems—A New Parametric Study, Mater. Sci. Eng. A, 2007, 445–446, p. 493–500CrossRef T.C. Illingworth, I.O. Golosnoy, T.W. Clyne, Modelling of Transient Liquid Phase Bonding in Binary Systems—A New Parametric Study, Mater. Sci. Eng. A, 2007, 445–446, p. 493–500CrossRef
13.
Zurück zum Zitat G. Lesoult, Center for Joining of Materials Report Carnegie Mellon University, Pittsburgh, 1996, p 14 G. Lesoult, Center for Joining of Materials Report Carnegie Mellon University, Pittsburgh, 1996, p 14
14.
Zurück zum Zitat G.J. Richardson, D.N. Hawkins and C.M. Sellars, Worked Examples in Metalworking. The Institute of Metals, London, 1985, p. 34 G.J. Richardson, D.N. Hawkins and C.M. Sellars, Worked Examples in Metalworking. The Institute of Metals, London, 1985, p. 34
15.
Zurück zum Zitat J.H. Hollomon, L.D. Hollomon, Time-Temperature Relations in Tempering Steel, Trans. AIME, 1945, 162, p 223–249 J.H. Hollomon, L.D. Hollomon, Time-Temperature Relations in Tempering Steel, Trans. AIME, 1945, 162, p 223–249
16.
Zurück zum Zitat T.B. Massalski, T.L. Murray, H.L. Bennett, H. Baker, Binary Alloy Phase Diagrams. American Society for Metals, Metals Park, OH, 1986, p 56 T.B. Massalski, T.L. Murray, H.L. Bennett, H. Baker, Binary Alloy Phase Diagrams. American Society for Metals, Metals Park, OH, 1986, p 56
17.
Zurück zum Zitat K. Majima, S. Orito, H. Mitani, Lattice and Grain Boundary Diffusion of Cu in γ-Fe, Trans. Jpn. Inst. Met., 1978, 9, p 663–668CrossRef K. Majima, S. Orito, H. Mitani, Lattice and Grain Boundary Diffusion of Cu in γ-Fe, Trans. Jpn. Inst. Met., 1978, 9, p 663–668CrossRef
18.
Zurück zum Zitat Y. Zhou, Analytical Modeling of Isothermal Solidification During Transient Liquid Phase (TLP) bonding, J. Mater. Sci. Lett., 2001, 20, p 841–844CrossRef Y. Zhou, Analytical Modeling of Isothermal Solidification During Transient Liquid Phase (TLP) bonding, J. Mater. Sci. Lett., 2001, 20, p 841–844CrossRef
19.
Zurück zum Zitat K.A. Thole, Daniel D.G. Knost, Heat Transfer and Film-Cooling for the Endwall of a First Stage Turbine Vane, Int. J. Heat Mass Transfer, 2005, 48, p 5255–5269CrossRef K.A. Thole, Daniel D.G. Knost, Heat Transfer and Film-Cooling for the Endwall of a First Stage Turbine Vane, Int. J. Heat Mass Transfer, 2005, 48, p 5255–5269CrossRef
Metadaten
Titel
Research on Transient Liquid Phase Diffusion Bonding of Steel Sandwich Panels Under Small Plastic Deformation
verfasst von
H. Li
Z. X. Li
Publikationsdatum
01.12.2008
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 6/2008
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-008-9244-2

Weitere Artikel der Ausgabe 6/2008

Journal of Materials Engineering and Performance 6/2008 Zur Ausgabe

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.