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Journal of Materials Science
Erschienen in: Journal of Materials Science 7/2019

14.12.2018 | Polymers

Sandwich-type porous polyimide film with improved dielectric, water resistance and mechanical properties

Erschienen in: Journal of Materials Science | Ausgabe 7/2019

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Abstract

The simultaneous improvement of dielectric, mechanical and water resistance properties of dielectric materials is extremely important for their practical use, but rarely been realized. Here, the comprehensive properties of polyimide (PI) film were enhanced through the construction of sandwich-type porous film using the microemulsion method. Due to the introduction of porous structure on both sides of PI film, apparent decreases were observed in dielectric constant (16.50%) and water absorption (82.7%), accompanied by increases in tensile strength (5.14%) and tensile modulus (41.17%), compared to flat PI film. Furthermore, excellent durability of low dielectric constant of the sandwich-type porous film under moist environment was demonstrated since 1.76% of increase was found upon exposing to 75% R.H. for 32 h. This provides a novel method to optimize the comprehensive properties of dielectric materials and also displays underlying insight for the development of functional materials in electronic and electric areas.
Vorheriger Artikel Asymmetric wetting Janus fabrics with double-woven structure for oil/water separation
Nächster Artikel Excellent self-healing and antifogging coatings based on polyvinyl alcohol/hydrolyzed poly(styrene-co-maleic anhydride)

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Metadaten
Titel
Sandwich-type porous polyimide film with improved dielectric, water resistance and mechanical properties
Publikationsdatum
14.12.2018
Erschienen in
Journal of Materials Science / Ausgabe 7/2019
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-018-03248-z

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