Skip to main content
Erschienen in: Journal of Computational Electronics 1/2014

01.03.2014

Signal integrity and propagation delay analysis using FDTD technique for VLSI interconnects

verfasst von: Devendra Kumar Sharma, Brajesh Kumar Kaushik, R. K. Sharma

Erschienen in: Journal of Computational Electronics | Ausgabe 1/2014

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

In UDSM technology, on-chip interconnect wires form a complex geometry and introduces wire and coupling parasitics. The coupling parasitics (M,C C ) introduce crosstalk noise which may lead to critical delays/logic malfunctions. This paper analyzes the dependency of crosstalk noise and delay on coupling parasitics for simultaneously switching inputs using FDTD technique. The FDTD method is used because it is a strong mathematical platform for the analysis of time domain behavior of coupled lines. For implementation of FDTD algorithm, discretizations are carried out in time and space both. To ensure stability in FDTD solution, the discrete voltage points are interlaced by current points in both space and time. To validate the proposed method, FDTD computations are carried out and results are compared with those of conventional SPICE results. A good agreement of FDTD results has been observed with respect to SPICE results. An average error of less than 2 % is observed for the proposed FDTD algorithm with respect to SPICE.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Rabaey, J.M.: Digital Integrated Circuits, A Design Perspective. Prentice-Hall, Englewood Cliffs (1996) Rabaey, J.M.: Digital Integrated Circuits, A Design Perspective. Prentice-Hall, Englewood Cliffs (1996)
2.
Zurück zum Zitat Sylvester, D., Hu, C., Nakagawa, O.S., Oh, S.-Y.: Interconnect scaling: signal integrity and performance in future high speed CMOS design. In: IEEE Symp. on VLSI Technology Digest of Technical Paper, pp. 42–43 (1998) Sylvester, D., Hu, C., Nakagawa, O.S., Oh, S.-Y.: Interconnect scaling: signal integrity and performance in future high speed CMOS design. In: IEEE Symp. on VLSI Technology Digest of Technical Paper, pp. 42–43 (1998)
3.
Zurück zum Zitat Roy, A., Xu, J., Chowdhury, M.H.: Analysis of the Impacts of Signal Slew and Skew on the Behavior of Coupled RLC Interconnects for Different Switching Patterns. IEEE Trans. on VLSI Systems 18(2) (2010) Roy, A., Xu, J., Chowdhury, M.H.: Analysis of the Impacts of Signal Slew and Skew on the Behavior of Coupled RLC Interconnects for Different Switching Patterns. IEEE Trans. on VLSI Systems 18(2) (2010)
4.
Zurück zum Zitat Kaushik, B.K., Sarkar, S.: Crosstalk analysis for a CMOS-gate-driven coupled interconnects. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 27(6), 1150–1154 (2008) CrossRef Kaushik, B.K., Sarkar, S.: Crosstalk analysis for a CMOS-gate-driven coupled interconnects. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 27(6), 1150–1154 (2008) CrossRef
5.
Zurück zum Zitat Kaushik, B.K., Sarkar, S., Agarwal, R.P., Joshi, R.C.: Effect of line resistance and driver width on crosstalk in coupled VLSI interconnects. Microelectron. Int. 24(3), 42–45 (2007) CrossRef Kaushik, B.K., Sarkar, S., Agarwal, R.P., Joshi, R.C.: Effect of line resistance and driver width on crosstalk in coupled VLSI interconnects. Microelectron. Int. 24(3), 42–45 (2007) CrossRef
6.
Zurück zum Zitat Kaushik, B.K., Sarkar, S., Agarwal, R.P., Joshi, R.C.: Crosstalk analysis and repeater insertion in crosstalk aware coupled VLSI interconnects. Microelectron. Int. 23(3), 55–63 (2006) CrossRef Kaushik, B.K., Sarkar, S., Agarwal, R.P., Joshi, R.C.: Crosstalk analysis and repeater insertion in crosstalk aware coupled VLSI interconnects. Microelectron. Int. 23(3), 55–63 (2006) CrossRef
7.
Zurück zum Zitat Elgamel, M.A., Bayoumi, M.A.: Interconnect noise analysis and optimization in deep submicron technology. IEEE Circuits Syst. Mag. 3(4), 6–17 (2003) CrossRef Elgamel, M.A., Bayoumi, M.A.: Interconnect noise analysis and optimization in deep submicron technology. IEEE Circuits Syst. Mag. 3(4), 6–17 (2003) CrossRef
8.
Zurück zum Zitat Ismail, Y.I., Friedman, E.G.: Effect of inductance on propagation delay and repeater insertion in VLSI circuits. IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 8(2), 195–206 (2000) CrossRef Ismail, Y.I., Friedman, E.G.: Effect of inductance on propagation delay and repeater insertion in VLSI circuits. IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 8(2), 195–206 (2000) CrossRef
9.
Zurück zum Zitat Roy, A., Mahmoud, N., Chowdhury, M.H.: Effects of coupling capacitance and inductance on delay uncertainty and clock skew. In: Proc. of IEEE/ACH Design Automation Conf., pp. 184–187, June (2007) Roy, A., Mahmoud, N., Chowdhury, M.H.: Effects of coupling capacitance and inductance on delay uncertainty and clock skew. In: Proc. of IEEE/ACH Design Automation Conf., pp. 184–187, June (2007)
10.
Zurück zum Zitat Sharma, D.K., Kaushik, B.K., Sharma, R.K.: Effect of mutual inductance and coupling capacitance on propagation delay and peak overshoot in dynamically switching inputs. In: Proc. IEEE Intl. Conf. on Emerging Trends in Engineering and Technology (ICETET), pp. 765–769, Nov. (2010) Sharma, D.K., Kaushik, B.K., Sharma, R.K.: Effect of mutual inductance and coupling capacitance on propagation delay and peak overshoot in dynamically switching inputs. In: Proc. IEEE Intl. Conf. on Emerging Trends in Engineering and Technology (ICETET), pp. 765–769, Nov. (2010)
11.
Zurück zum Zitat Agarwal, K., Sylvester, D., Blaauw, D.: Modeling and analysis of crosstalk noise in coupled RLC interconnects. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 25, 892–901 (2006) CrossRef Agarwal, K., Sylvester, D., Blaauw, D.: Modeling and analysis of crosstalk noise in coupled RLC interconnects. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 25, 892–901 (2006) CrossRef
12.
Zurück zum Zitat Li, X.C., Mao, J.-F., Swaminathan, M.: Transient analysis of CMOS-gate driven RLCG interconnects based on FDTD. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 30(4), 574–583 (2011) CrossRef Li, X.C., Mao, J.-F., Swaminathan, M.: Transient analysis of CMOS-gate driven RLCG interconnects based on FDTD. IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. 30(4), 574–583 (2011) CrossRef
13.
Zurück zum Zitat Sharma, D.K., Mittal, S., Kaushik, B.K., Sharma, R.K., Yadav, K.L., Majumder, M.K.: Dynamic crosstalk analysis in RLC modeled interconnects using FDTD method. In: IEEE Intl. Conf. on Computer and Communication Technology (ICCCT), pp. 326–330, Nov. (2012) Sharma, D.K., Mittal, S., Kaushik, B.K., Sharma, R.K., Yadav, K.L., Majumder, M.K.: Dynamic crosstalk analysis in RLC modeled interconnects using FDTD method. In: IEEE Intl. Conf. on Computer and Communication Technology (ICCCT), pp. 326–330, Nov. (2012)
14.
Zurück zum Zitat Roden, J.A., Paul, C.R., Smith, W.T., Gedney, S.D.: Finite-difference, time-domain analysis of lossy transmission lines. IEEE Trans. Electromagn. Compat. 38(1), 15–24 (1996) CrossRef Roden, J.A., Paul, C.R., Smith, W.T., Gedney, S.D.: Finite-difference, time-domain analysis of lossy transmission lines. IEEE Trans. Electromagn. Compat. 38(1), 15–24 (1996) CrossRef
15.
Zurück zum Zitat Farahat, N., EI-Raouf, A.H.E., Mittra, R.: Analysis of interconnect lines using the finite-difference-time-domain (FDTD) method. Microw. Opt. Technol. Lett. 34(1), 6–9 (2002) CrossRef Farahat, N., EI-Raouf, A.H.E., Mittra, R.: Analysis of interconnect lines using the finite-difference-time-domain (FDTD) method. Microw. Opt. Technol. Lett. 34(1), 6–9 (2002) CrossRef
16.
Zurück zum Zitat Afrooz, K., Abdipour, A., Tavakoli, A., Movahhedi, M.: Time domain analysis of lossy nonuniform transmission line using FDTD technique. In: Proc. Asia-Pacific Conf. on Applied Electromagnetics, Dec. (2007) Afrooz, K., Abdipour, A., Tavakoli, A., Movahhedi, M.: Time domain analysis of lossy nonuniform transmission line using FDTD technique. In: Proc. Asia-Pacific Conf. on Applied Electromagnetics, Dec. (2007)
17.
Zurück zum Zitat Paul, C.R.: Analysis of Multiconductor Transmission Lines. Wily Interscience, New York (1994) Paul, C.R.: Analysis of Multiconductor Transmission Lines. Wily Interscience, New York (1994)
18.
Zurück zum Zitat Paul, C.R.: Incorporation of terminal constraints in the FDTD analysis of transmission lines. IEEE Trans. Electromagn. Compat. 36(2), 85–91 (1994) CrossRef Paul, C.R.: Incorporation of terminal constraints in the FDTD analysis of transmission lines. IEEE Trans. Electromagn. Compat. 36(2), 85–91 (1994) CrossRef
Metadaten
Titel
Signal integrity and propagation delay analysis using FDTD technique for VLSI interconnects
verfasst von
Devendra Kumar Sharma
Brajesh Kumar Kaushik
R. K. Sharma
Publikationsdatum
01.03.2014
Verlag
Springer US
Erschienen in
Journal of Computational Electronics / Ausgabe 1/2014
Print ISSN: 1569-8025
Elektronische ISSN: 1572-8137
DOI
https://doi.org/10.1007/s10825-013-0527-y

Weitere Artikel der Ausgabe 1/2014

Journal of Computational Electronics 1/2014 Zur Ausgabe

Neuer Inhalt