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Journal of Electronic Materials
Erschienen in: Journal of Electronic Materials 5/2024

07.02.2024 | Original Research Article

Solvothermal Synthesis and Growth of Covalent Organic Framework Electrochromic Film with Triphenylamine Active Unit

verfasst von: Shanxin Xiong, Yukun Zhang, Wei Zhang, Nana Yang, Fengyan Lv, Jingru Guo, Xin Cui, Ke Fang, Min Chen, Chenxu Wang, Chunxia Hua, Runlan Zhang, Jia Chu, Jianwei Xu

Erschienen in: Journal of Electronic Materials | Ausgabe 5/2024

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Abstract

Covalent organic frameworks (COFs) with reversible redox units and a conjugated molecular skeleton possess novel photoelectrochemical properties. In this work, tris(4-aminophenyl)amine and 4,4-biphenyldiformaldehyde were chosen to synthesize TABP-COF electrochromic film with triphenylamine (TPA) active unit by a solvothermal method in a Teflon-lined reactor. The growth process and reaction time optimization of the TABP-COF were studied. TABP-COF shows a self-assembly growth process from an array of nanosheets to nanospheres. Owing to the redox characteristics of TPA, the TABP-COF film exhibits reversible electrochromic behavior. With a solvothermal reaction time of 72 h, the TABP-COF-3 film exhibits the best electrochromic properties, including contrast of 0.483 and response time of 7.3 s/13.6 s. Considering the abundance of redox-active units that can be chosen, COF materials with different redox units and color changes can be designed for a variety of applications in the field of electrochromic materials.
Vorheriger Artikel Analysis of Indigo Carmine by Polymer-Modified Biosensor Using Electro-Polymerization Technique
Nächster Artikel High-Performance Microwave Absorption Properties of Pyramid-Shaped Metamaterials Based on Ni-Foam@Fe3O4

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Metadaten
Titel
Solvothermal Synthesis and Growth of Covalent Organic Framework Electrochromic Film with Triphenylamine Active Unit
verfasst von
Shanxin Xiong
Yukun Zhang
Wei Zhang
Nana Yang
Fengyan Lv
Jingru Guo
Xin Cui
Ke Fang
Min Chen
Chenxu Wang
Chunxia Hua
Runlan Zhang
Jia Chu
Jianwei Xu
Publikationsdatum
07.02.2024
Verlag
Springer US
Erschienen in
Journal of Electronic Materials / Ausgabe 5/2024
Print ISSN: 0361-5235
Elektronische ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-024-10937-w

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