Ausgabe 12/2012
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XI
Inhalt (27 Artikel)
Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations
Huxiao Xie, Nikhilesh Chawla, Kabir Mirpuri
Liquid-State Interfacial Reactions of Sn-Zn/Co Couples at 250°C
Chao-hong Wang, Sheng-en Huang, Jian-lin Liu
Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads
C.E. Ho, W.H. Wu, C.C. Wang, Y.C. Lin
Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications
C.E. Ho, T.T. Kuo, W. Gierlotka, F.M. Ma
Interfacial Reactions Between Sn-Zn Alloys and Au Substrate
Yee-wen Yen, Ming-chih Lin, Cheng-kuan Lin, Wan-ching Chen
Kinetics of Solid-State Reactive Diffusion in the (Ni-Cr)/Sn System
K. Motojima, T. Asano, W. Shinmei, M. Kajihara
Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10)
Jin-Yi Wang, Chih-Fan Lin, Chih-Ming Chen
Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates
Tien-Chen Hu, Feng-chih Hsu, An-Wen Huang, Ming-Tzer Lin
Electromigration Study on Sn(Cu) Solder/Ni(P) Joint Interfaces
S.H. Wu, Y.J. Hu, C.T. Lu, T.S. Huang, Y.H. Chang, C.Y. Liu
Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process
Bo-Mook Chung, Yong-Ho Baek, Jaeho Choi, Joo-Youl Huh
Atomic Mobilities in the Ag-Cu-Sn Face-Centered Cubic Lattice
W. Gierlotka, Y.H. Chen, M.A. Haque, M.A. Rahman
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
Yu-Hsiang Hsiao, Kwang-Lung Lin, Chiu-Wen Lee, Yu-Hsiu Shao, Yi-Shao Lai
Fabrication of CIGS Films by Electrodeposition Method for Photovoltaic Cells
Hyunju Lee, Hyukjoo Yoon, Changwook Ji, Dongyun Lee, Jae-Ho Lee, Jae-Ho Yun, Yangdo Kim
Electrical and Optical Properties of p-Type Li,Cu-Codoped NiO Thin Films
Xinman Chen, Lingzhi Zhao, Qiaoli Niu
Effect of Inverse Doped Surface Layer in Schottky Barrier Modification: A Numerical Study
Subhash Chand, Priyanka Kaushal, Jozef Osvald
Improved Optoelectronic Properties of Rapid Thermally Annealed Dilute Nitride GaInNAs Photodetectors
S.L. Tan, C.J. Hunter, S. Zhang, L.J.J. Tan, Y.L. Goh, J.S. Ng, I.P. Marko, S.J. Sweeney, A.R. Adams, J. Allam, J.P.R. David
Thermoelectric Properties of Heavy Rare Earth Filled Skutterudites Dy y Fe x Co4−x Sb12
Tao Luo, Ruiheng Liu, Pengfei Qiu, Yanfei Zhou, Zhiwei Lin, Yong Lei, Xun Shi, Wenqing Zhang, Lidong Chen
Effects of Bi2Se3 Nanoparticle Inclusions on the Microstructure and Thermoelectric Properties of Bi2Te3-Based Nanocomposites
HeeJin Kim, Mi-Kyung Han, Chul-Hyun Yo, Wooyoung Lee, Sung-Jin Kim
Electrode Materials for Ge2Sb2Te5-Based Memristors
Q. Wang, H.J. Sun, J.J. Zhang, X.H. Xu, X.S. Miao
Highly Textured Mn15Si26 Film Obtained by High-Temperature Treatment
R. Zirmi, A. Portavoce, R. Delattre, O. Thomas, M.S. Belkaid, M.-C. Record
Effect of a Nanodimensional Polyethylenimine Layer on Current–Voltage Characteristics of Hybrid Structures Based on Single-Crystal Silicon
I.V. Malyar, D.A. Gorin, S.V. Stetsyura, S. Santer
Microstructural Investigation of Interfacial Features in Al Wire Bonds
G. Khatibi, B. Weiss, J. Bernardi, S. Schwarz
Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation
X. N. Li, L.J. Liu, X.Y. Zhang, J.P. Chu, Q. Wang, C. Dong
Rediscovery of the Role of the i-Layer in n-ZnO/SiO2/p-GaN Through Observations from Both the ZnO and GaN Sides
Yuanda Liu, Hongwei Liang, Xiaochuan Xia, Jiming Bian, Rensheng Shen, Yang Liu, Yingmin Luo, Guotong Du