Ausgabe 8/2010
Inhalt (35 Artikel)
High-Temperature Thermoelectric Characterization of III–V Semiconductor Thin Films by Oxide Bonding
Je-Hyeong Bahk, Gehong Zeng, Joshua M. O. Zide, Hong Lu, Rajeev Singh, Di Liang, Ashok T. Ramu, Peter Burke, Zhixi Bian, Arthur C. Gossard, Ali Shakouri, John E. Bowers
Thermoelectric Properties of Layer-Antiferromagnet CuCrS2
Girish C. Tewari, T. S. Tripathi, A. K. Rastogi
Critical Layer Thickness in Exponentially Graded Heteroepitaxial Layers
D. Sidoti, S. Xhurxhi, T. Kujofsa, S. Cheruku, J. Reed, B. Bertoli, P. B. Rago, E. N. Suarez, F. C. Jain, J. E. Ayers
Structural Properties of AlN Grown on Sapphire at Plasma Self-Heating Conditions Using Reactive Magnetron Sputter Deposition
Hui-Chan Seo, Ivan Petrov, Kyekyoon Kim
Electron–Electron Interactions in Sb-Doped SnO2 Thin Films
Tülay Serin, Abdullah Yildiz, Necmi Serin, Nurcan Yildirim, Figen Özyurt, Mehmet Kasap
Improved Thermoelectric Performance and Mechanical Properties of Nanostructured Melt-Spun β-Zn4Sb3
Dekui Qi, Xinfeng Tang, Han Li, Yonggao Yan, Qingjie Zhang
Interface Formation and Electrical Transport in SnO2:Eu3+/GaAs Heterojunction Deposited by Sol–Gel Dip-Coating and Resistive Evaporation
Tatiane F. Pineiz, Luis V. A. Scalvi, Margarida J. Saeki, Evandro A. de Morais
Comparative Study on the Properties of Galvanically Deposited Nano- and Microcrystalline Thin Films of PbSe
Nillohit Mukherjee, Anup Mondal
Optical Study of Filled Tetrahedral Compounds Li3AlN2 and Li3GaN2
M. Dadsetani, S. Namjoo, H. Nejati
Crystallization of Amorphous Si0.6Ge0.4 Nanoparticles Embedded in SiO2: Crystallinity Versus Compositional Stability
A. Rodríguez, T. Rodríguez, Á. C. Prieto, J. Jiménez, A. Kling, C. Ballesteros, J. Sangrador
Characterization by Internal Photoemission Spectroscopy of Single-Crystal CVD Diamond Schottky Barrier Diodes
Saman Majdi, Markus Gabrysch, Richard Balmer, Daniel Twitchen, Jan Isberg
Catalyst-Free Direct Vapor-Phase Growth of Hexagonal ZnO Nanowires on α-Al2O3
S. S. Hullavarad, N. V. Hullavarad, R. D. Vispute, T. Venkatesan, S. J. Kilpatrick, M. H. Ervin, B. Nichols, A. E. Wickenden
Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test
Lei Nie, Maik Mueller, Michael Osterman, Michael Pecht
Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders
Hiroshi Ogura, Minoru Maruyama, Ryo Matsubayashi, Tetsuya Ogawa, Shigeyoshi Nakamura, Teruo Komatsu, Hiroshi Nagasawa, Akio Ichimura, Seiji Isoda
Improvement of High-Temperature Performance of Zn-Sn Solder Joint
Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto
Crystallographic Properties of Ge/Si Heterojunctions Fabricated by Wet Wafer Bonding
Hiroshi Kanbe, Mami Hirose, Tatsuya Ito, Masafumi Taniwaki
Influence of Cadmium Composition on CH4–H2-Based Inductively Coupled Plasma Etching of Hg1−x Cd x Te
F. Boulard, J. Baylet, C. Cardinaud
Field Emission from Silicon Implanted with Carbon and Nitrogen Followed by Electron Beam Annealing
D.A. Carder, A. Markwitz, J. Kennedy
Electrical Conductivity of Graphene Composites with In and In-Ga Alloy
A. Naga Sruti, K. Jagannadham
Weakening of the Cu/Cu3Sn(100) Interface by Bi Impurities
X. Y. Pang, P. J. Shang, S. Q. Wang, Z. Q. Liu, J. K. Shang
A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles
Y. Morisada, T. Nagaoka, M. Fukusumi, Y. Kashiwagi, M. Yamamoto, M. Nakamoto
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
C. C. Chang, Y. W. Wang, Y. S. Lai, C. R. Kao
Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints
S. Belyakov, H. V. Atkinson, S. P. A. Gill
Effect of Ag Content on Solidification Cracking Susceptibility of Sn-Ag-Cu Solder Joints
Wei Lu, Yaowu Shi, Yongping Lei
Coupling Effect of the Interfacial Reaction in Co/Sn/Cu Diffusion Couples
Chao-hong Wang, Chun-yi Kuo
Effects of Current Stressing on Formation and Evolution of Kirkendall Voids at Sn–3.5Ag/Cu Interface
C. Yu, Y. Yang, H. Lu, J. M. Chen
The Mechanism of Residual Stress Relief for Various Tin Grain Structures
Cheng-Fu Yu, Ker-Chang Hsieh
Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films
Kazuhiro Ito, Kazuyuki Kohama, Tomohisa Tanaka, Kenichi Mori, Kazuyoshi Maekawa, Yasuharu Shirai, Masanori Murakami
Dielectric and Electrical Conductivity Relaxation in 0.5Li2O-0.5Na2O-2B2O3 Glasses
Rahul Vaish, K.B.R. Varma
Nonvolatile Metal–Oxide–Semiconductor Capacitors with Ru-RuO x Composite Nanodots Embedded in Atomic-Layer-Deposited Al2O3 Films
Hong-Yan Gou, Shi-Jin Ding, Yue Huang, Qing-Qing Sun, Wei Zhang, Peng-Fei Wang, Zhenyi Chen
Effective Permittivity Calculation of Composites with Interpenetrating Phases
Yu Zeng, Hongtao Zhang, Hongyan Zhang, Zhipeng Hu
Ti-O Direct-Current-Sintered Bodies and Their Use for Sputter Deposition of TiO Thin Films: Fabrication and Characterization
Masanari Tomozawa, Kimihiro Ozaki, Masashi Mikami, Keizo Kobayashi