Ausgabe 9/2012
Inhalt (45 Artikel)
Measurement of Thermal Conductivity Using Steady-State Isothermal Conditions and Validation by Comparison with Thermoelectric Device Performance
Patrick J. Taylor, Jay R. Maddux, Parvez N. Uppal
Size-Quantization Semimetal–Semiconductor Transition in Bi0.98Sb0.02 Nanowires: Thermoelectric Properties
A.A. Nikolaeva, L.A. Konopko, T.E. Huber, P.P. Bodiul, I.A. Popov, E.F. Moloshnik
Preparation and Transport Properties of Bi2O2Se Single Crystals
C. Drasar, P. Ruleova, L. Benes, P. Lostak
Thermal Conductivity of InAs/GaSb Type II Superlattice
Chuanle Zhou, B. -M. Nguyen, M. Razeghi, M. Grayson
Thermoelectric Figure of Merit Enhancement in Bi2Te3-Coated Bi Composites
T. W. Lan, Y. C. Chen, J. C. Ho, S. G. Shyu, Y. Y. Chen
An Investigation of Electrical Contacts for Higher Manganese Silicide
Xinghua Shi, Zahra Zamanipour, Jerzy S. Krasinski, Alan Tree, Daryoosh Vashaee
Thermoelectric and Magnetic Properties of Ca0.98RE0.02MnO3−δ (RE = Sm, Gd, and Dy)
Ankam Bhaskar, Chia-Jyi Liu, J.J. Yuan
Effect of the Surface Morphology of Seed and Mask Layers on InP Grown on Si by Epitaxial Lateral Overgrowth
Carl Junesand, Chen Hu, Zhechao Wang, Wondwosen Metaferia, Pritesh Dagur, Galia Pozina, Lars Hultman, Sebastian Lourdudoss
Active Layer Thickness Effects on the On-State Current and Pulse Measurement at Room Temperature on Deposited Zinc Oxide Thin-Film Transistors
Sarbani Basu, Pramod K. Singh, C. Ghanshyam, Pawan Kapur, Yeong-Her Wang
Anodized Macroporous Silicon Anode for Integration of Lithium-Ion Batteries on Chips
Xida Sun, Hong Huang, Kuan-Lun Chu, Yan Zhuang
Effect of Target Density on Microstructural, Electrical, and Optical Properties of Indium Tin Oxide Thin Films
Guisheng Zhu, Li Zhi, Huijuan Yang, Huarui Xu, Aibing Yu
Phosphorus Doping Effect in a Zinc Oxide Channel Layer to Improve the Performance of Oxide Thin-Film Transistors
Dong-Suk Han, Yeon-Keon Moon, Sih Lee, Kyung-Taek Kim, Dae-Yong Moon, Sang-Ho Lee, Woong-Sun Kim, Jong-Wan Park
AC Conductivity and Diffuse Reflectance Studies of Ag-TiO2 Nanoparticles
A.K. Abdul Gafoor, M.M. Musthafa, P.P. Pradyumnan
Preparation and Characterization of New Sr5−x La x Nb4−x Ti1+x O17 Microwave Dielectric Ceramics
Yaseen Iqbal, Abdul Manan
Direct Electrosynthesis and Characterization of a New Soluble Polythiophene Derivative Containing Carboxyl Groups in Boron Trifluoride Diethyl Etherate
Yu He, Wenjuan Guo, Meishan Pei, Guangyou Zhang, Junzi Jiang
Failure Causes of a Polymer Resettable Circuit Protection Device
Shunfeng Cheng, Kwok Tom, Michael Pecht
Thermoelectric Performance Enhancement of Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) Composite Films by Addition of Dimethyl Sulfoxide and Urea
Fangfang Kong, Congcong Liu, Jingkun Xu, Yao Huang, Jianmin Wang, Zhi Sun
Electrical and Dielectric Properties of Exfoliated Graphite/Polyimide Composite Films with Low Percolation Threshold
Li Yu, Yi-He Zhang, Jiwu Shang, Shan-Ming Ke, Wang-shu Tong, Bo Shen, Hai-Tao Huang
Synthesis, Characterization, and Electroluminescent Properties of Pyridinylene Vinylene-Modified Phenylene Vinylene Copolymers
Rupei Tang, Wenqing Zhang, Deping Qian, Hua Zheng, Zhan’ao Tan
Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding
H. Liu, K. Wang, K.E. Aasmundtveit, N. Hoivik
Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures
Kittichai Fakpan, Yuichi Otsuka, Yoshiharu Mutoh, Shunsuke Inoue, Kohsoku Nagata, Kazuya Kodani
Interfacial Reaction of Molten Sn on a Strained Cu Electroplated Layer
Hsiao-An Pan, Chi-Pu Lin, Chih-Ming Chen
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, J. Wei
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints
Cai Chen, Lei Zhang, Jiaxi Zhao, Lihua Cao, J. K. Shang
Interfacial Reactions in Sn x Zn1−x (Liquid)/Ni(Solid) Couples at 873 K
Yuan Yuan, Dajian Li, Libin Liu, Gabriella Borzone
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
Ming-Hui Chu, S.W. Liang, Chih Chen, Annie T. Huang
Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation
Sungwon Han, Michael Osterman, Stephan Meschter, Michael Pecht
Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate
K.E. Yazzie, J.J. Williams, N. Chawla
Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications
Li-Ngee Ho, Hiroshi Nishikawa
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
A. Heryanto, W.N. Putra, A. Trigg, S. Gao, W.S. Kwon, F.X. Che, X.F. Ang, J. Wei, R. I Made, C.L. Gan, K.L. Pey
Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste
Tao Wang, Meihua Zhao, Xu Chen, Guo-Quan Lu, Khai Ngo, Shufang Luo
Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration
L. Peng, D.F. Lim, L. Zhang, H.Y. Li, C.S. Tan
HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process
Cheng-Li Chuang, Min-Yi Kang
Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature
Hui-wang Cui, Dong-sheng Li, Qiong Fan
An Analytical Approach to Determine the Pressure Distribution During Chemical Mechanical Polishing
Christian Ludwig, Meinhard Kuna
Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test
Jue Li, Tapio Tarvainen, Jaana Rich, Markus Turunen, Mervi Paulasto-Kröckel
Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate
Cheng-Li Chuang, Jong-Ning Aoh, Chi-Chuan Pan
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications
Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che
Retraction Note: Single-Phase β-Zn4Sb3 Prepared by a Mechanical Grinding Method
Chinatsu Okamura, Takashi Ueda, Kazuhiro Hasezaki