Ausgabe 9/2010
Inhalt (16 Artikel)
‘Lead Free’ thick film thermistors: a study of variation in glass frit concentration and organics composition
Shweta Jagtap, Sunit Rane, Suresh Gosavi, Dinesh Amalnerkar
Synthesis and DSC study on Sn3.5Ag alloy nanoparticles used for lower melting temperature solder
Changdong Zou, Yulai Gao, Bin Yang, Qijie Zhai
Investigation of rare earth-doped BiAg high-temperature solders
Yaowu Shi, Weiping Fang, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li
Electrical properties of R2O–Al2O3–SiO2 glass–ceramics for anodic bonding
Dehua Xiong, Hong Li, Jinshu Cheng
Crystallization characteristic and properties of some zinc containing soda lime silicate glasses
H. A. Abo-Mosallam, H. Darwish, S. M. Salman
Adjustment of the selenium amount during ion beam sputtering deposition of CIS thin films
Ping Fan, Guang-Xing Liang, Zhuang-Hao Zheng, Xing-Min Cai, Dong-Ping Zhang
High-T C phase transition in K2Ti6O13 lead-free ceramic synthesised using solid-state reaction
Satyendra V. Vikram, D. M. Phase, Vishal S. Chandel
Nanocrystalline grain size in ZnS thin films deposited by chemical bath technique
S. S. Kawar, B. H. Pawar
Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder
Lili Gao, Songbai Xue, Liang Zhang, Zhengxiang Xiao, Wei Dai, Feng Ji, Huan Ye, Guang Zeng
Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging
Fengqun Lang, Hiroshi Nakagawa, Masahiro Aoyagi, Hiromichi Ohashi, Hiroshi Yamaguchi
Electron field emission properties of carbon nanoflakes prepared by RF sputtering
Wen-Ching Shih, Jian-Min Jeng, Jyi-Tsong Lo, Huang-Chin Chen, I-Nan Lin
Microwave dielectric properties of Ba5Nb4O15 ceramic by molten salt method
Huanfu Zhou, Xiuli Chen, Liang Fang, Changzheng Hu, Hong Wang
Effect of geometry and dielectric material on thermo-mechanical strain on micro-vias in build-up substrates
Kimihiro Yamanaka, Teruya Fujisaki, Manabu Ichinose, Takafumi Ooyoshi
Fabrication of ZnO nanostructure within the AAO template by electrochemical deposition
Haiming Zhang, Xiaojie Li, Guofeng Hu, Yujie Li
Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board
K. C. Yung, H. Liem, H. S. Choy, T. M. Yue