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Erschienen in: Journal of Materials Science 10/2016

09.02.2016 | Original Paper

Structure–property relationship of new polyimide–organically modified silicate–phosphotungstic acid hybrid material system

verfasst von: Fábio A. S. Ferreira, Thiago Amaral, Orlando Armando Elguera Ysnaga, Marcelo A. Pereira-da-Silva, José H. Lopes, James P. Lewicki, Marcus A. Worsley, José F. Schneider, Germano Tremiliosi-Filho, Ubirajara P. Rodrigues-Filho

Erschienen in: Journal of Materials Science | Ausgabe 10/2016

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Abstract

A new hybrid material system was successfully developed from the combination of polyimide (PI), organically modified silicate (ORMOSIL), and phosphotungstic acid (HPW) from polycondensation reactions and sol–gel process. The materials were obtained in the form of flexible and free-standing films, with the formation of PI and ORMOSIL network confirmed by Fourier transform infrared. Solid-state phosphorus-31 nuclear magnetic resonance evaluated the HPW structure and confirmed its presence and also structural integrity in the materials after synthesis procedure. Thermogravimetric analysis revealed that the materials were thermally stable up to 773 K, and scanning electron microscopy images and X-ray micro-fluorescence mapping showed very good compatibility between the organic and inorganic phases with ORMOSIL improving the HPW dispersion. Furthermore, both ORMOSIL and HPW enhanced the permittivity of the materials from 2.5 to 4.3, compared to the neat PI, appointing them as potential candidates for electric and electronic applications.

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Metadaten
Titel
Structure–property relationship of new polyimide–organically modified silicate–phosphotungstic acid hybrid material system
verfasst von
Fábio A. S. Ferreira
Thiago Amaral
Orlando Armando Elguera Ysnaga
Marcelo A. Pereira-da-Silva
José H. Lopes
James P. Lewicki
Marcus A. Worsley
José F. Schneider
Germano Tremiliosi-Filho
Ubirajara P. Rodrigues-Filho
Publikationsdatum
09.02.2016
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 10/2016
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-016-9773-2

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