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Erschienen in: Journal of Materials Engineering and Performance 10/2014

01.10.2014

Synthesis and Characterization of Silver Nanoparticles and Silver Inks: Review on the Past and Recent Technology Roadmaps

verfasst von: Chin Yung Lai, Choke Fei Cheong, Jit Singh Mandeep, Huda Binti Abdullah, Nowshad Amin, Khin Wee Lai

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 10/2014

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Abstract

The synthesis of silver nanoparticles for silver ink formation has attracted broad interest in the electronic part printing and semiconductor chip industry due to the extraordinary electrical and mechanical properties of these materials. The preparation of silver nanoparticles through a physical or chemical reduction process is the most common methodology applied to obtain nanoparticles with the required size, shape and surface morphology. The chemical solution or solvent carrier applied for silver ink formulation must be applied simultaneously with the direct writing technique to produce the desired adherence, viscosity, and reliable performance. This review paper discusses the details concerning the past and recent advancement of the synthesis and characterization of silver nanoparticles and silver ink formation. A review on the advantages of various sintering techniques, which aim to achieve the electrical and mechanical properties of the required printed structure, is also included. A brief summary concerning the recent challenges and improvement approaches is presented at the end of this review.

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Metadaten
Titel
Synthesis and Characterization of Silver Nanoparticles and Silver Inks: Review on the Past and Recent Technology Roadmaps
verfasst von
Chin Yung Lai
Choke Fei Cheong
Jit Singh Mandeep
Huda Binti Abdullah
Nowshad Amin
Khin Wee Lai
Publikationsdatum
01.10.2014
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 10/2014
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-014-1166-6

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