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Erschienen in:
IoT: Bird’s Eye View, Megatrends and Perspectives Kapitel lesen Erstes Kapitel lesen

2017 | OriginalPaper | Buchkapitel

16. System Packaging and Assembly in IoT Nodes

verfasst von : You Qian, Chengkuo Lee

Erschienen in: Enabling the Internet of Things

Verlag: Springer International Publishing

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Abstract

The internet of things is the networks of physical “thing” embedded with sensors, integrated circuits and power source. Thus, packaging all these elements into one IoT nodes is essential for promoting this technology. In this chapter, some of the popular and commercially available packaging technologies such as wire bonding, flip-chip bonding, tape automated bonding, etc. are reviewed. Secondly, wafer level packaging is emphasized as it can be used as a low cost packaging technology, usually because the packaging cost is much higher than other cost associated with device manufacturing. Recent progress on packaging for wearable electronics, silicon Photonics and energy harvesters are also included. In the later part, infrared sensors have been used to demonstrate the packaging constraints imposed by device performance and application requirements, various packaging solutions available at an individual sensor level and complicated array level.

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Vorheriges Kapitel Battery Technologies for IoT
Nächstes Kapitel An IPv6 Energy-Harvested WSN Demonstrator Compatible with Indoor Applications
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Metadaten
Titel
System Packaging and Assembly in IoT Nodes
verfasst von
You Qian
Chengkuo Lee
Copyright-Jahr
2017
Buch
Enabling the Internet of Things

Print ISBN: 978-3-319-51480-2

Electronic ISBN: 978-3-319-51482-6

Copyright-Jahr: 2017

DOI
https://doi.org/10.1007/978-3-319-51482-6_16

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