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2017 | OriginalPaper | Buchkapitel

6. The Piezoresistive Effect of Top Down p-Type 3C-SiC Nanowires

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Abstract

The piezoresistance of SiC nanowires is of interest as a means to scale down devices size as well as to enhance the sensitivity of sensors (Phan et al., J. Microelectromech. Syst. 24(6):1663–1677, 2015, [1]; Shao et al., Appl. Phys. Lett. 101(23):233109, 2012, [2]; Gao et al., Chem. Comm. 47(43):11993–11995, 2011, [3]). However, as presented in Chap. 1, there have been a limited number of experimental work on the piezoresistance of SiC, which were fabricated using bottom up process (Shao et al., Appl. Phys. Lett. 101(23):233109, 2012, [2]; Gao et al., Chem. Comm. 47(43):11993–11995, 2011, [3]; Bi et al., J. Mater. Chem. C 1(30):4514–4517, 2013, [4]).

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Literatur
1.
Zurück zum Zitat H.-P. Phan, D.V. Dao, K. Nakamura, S. Dimitrijev, N.-T. Nguyen, The piezoresistive effect of SiC for MEMS sensors at high temperatures: a review. J. Microelectromech. Syst. 24(6), 1663–1677 (2015)CrossRef H.-P. Phan, D.V. Dao, K. Nakamura, S. Dimitrijev, N.-T. Nguyen, The piezoresistive effect of SiC for MEMS sensors at high temperatures: a review. J. Microelectromech. Syst. 24(6), 1663–1677 (2015)CrossRef
2.
Zurück zum Zitat R. Shao, K. Zheng, Y. Zhang, Y. Li, Z. Zhang, X. Han, Piezoresistance behaviors of ultra-strained SiC nanowires. Appl. Phys. Lett. 101(23), 233109 (2012)CrossRef R. Shao, K. Zheng, Y. Zhang, Y. Li, Z. Zhang, X. Han, Piezoresistance behaviors of ultra-strained SiC nanowires. Appl. Phys. Lett. 101(23), 233109 (2012)CrossRef
3.
Zurück zum Zitat F. Gao, J. Zheng, M. Wang, G. Wei, W. Yang, Piezoresistance behaviors of p-type 6 H-SiC nanowires. Chem. Comm. 47(43), 11993–11995 (2011)CrossRef F. Gao, J. Zheng, M. Wang, G. Wei, W. Yang, Piezoresistance behaviors of p-type 6 H-SiC nanowires. Chem. Comm. 47(43), 11993–11995 (2011)CrossRef
4.
Zurück zum Zitat J. Bi, G. Wei, L. Wang, F. Gao, J. Zheng, B. Tang, W. Yang, Highly sensitive piezoresistance behaviors of n-type 3C-SiC nanowires. J. Mater. Chem. C 1(30), 4514–4517 (2013)CrossRef J. Bi, G. Wei, L. Wang, F. Gao, J. Zheng, B. Tang, W. Yang, Highly sensitive piezoresistance behaviors of n-type 3C-SiC nanowires. J. Mater. Chem. C 1(30), 4514–4517 (2013)CrossRef
5.
Zurück zum Zitat T. Dinh, H.-P. Phan, T. Kozeki, A. Qamar, T. Namazu, N.-T. Nguyen, D.V. Dao, Thermoresistive properties of p-type 3C-SiC nanoscale thin films for high-temperature MEMS thermal-based sensors. RSC Adv. 5, 106083–106086 (2015)CrossRef T. Dinh, H.-P. Phan, T. Kozeki, A. Qamar, T. Namazu, N.-T. Nguyen, D.V. Dao, Thermoresistive properties of p-type 3C-SiC nanoscale thin films for high-temperature MEMS thermal-based sensors. RSC Adv. 5, 106083–106086 (2015)CrossRef
6.
Zurück zum Zitat H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, D.V. Dao, The piezoresistive effect in top-down fabricated p-type 3C-SiC nanowires. IEEE Electron Device Lett. 37(8), 1029–1032 (2016)CrossRef H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, D.V. Dao, The piezoresistive effect in top-down fabricated p-type 3C-SiC nanowires. IEEE Electron Device Lett. 37(8), 1029–1032 (2016)CrossRef
7.
Zurück zum Zitat H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, D.V. Dao, Nano strain-amplifier: Making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects. Appl. Phys. Lett. 109(12), 123502 (2016)CrossRef H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, D.V. Dao, Nano strain-amplifier: Making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects. Appl. Phys. Lett. 109(12), 123502 (2016)CrossRef
8.
Zurück zum Zitat H. Huang, F. Spaepen, Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers. Acta Materialia 48(12), 3261–3269 (2000)CrossRef H. Huang, F. Spaepen, Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers. Acta Materialia 48(12), 3261–3269 (2000)CrossRef
9.
Zurück zum Zitat J.M. Wernik, S.A. Meguid, On the mechanical characterization of carbon nanotube reinforced epoxy adhesives. Mater. Des. 59, 19–32 (2014)CrossRef J.M. Wernik, S.A. Meguid, On the mechanical characterization of carbon nanotube reinforced epoxy adhesives. Mater. Des. 59, 19–32 (2014)CrossRef
10.
Zurück zum Zitat R.C. Hibbeler, Engineering Mechanics: Statics, 14th edn. (Pearson, 2015) R.C. Hibbeler, Engineering Mechanics: Statics, 14th edn. (Pearson, 2015)
Metadaten
Titel
The Piezoresistive Effect of Top Down p-Type 3C-SiC Nanowires
verfasst von
Hoang-Phuong Phan
Copyright-Jahr
2017
DOI
https://doi.org/10.1007/978-3-319-55544-7_6

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