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Microsystem Technologies

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08.02.2018 | Technical Paper

Thermal effect on bending, buckling and free vibration of functionally graded rectangular micro-plates possessing a variable length scale parameter

verfasst von: Reza Aghazadeh, Serkan Dag, Ender Cigeroglu

Erschienen in: Microsystem Technologies | Ausgabe 8/2018

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Abstract

Modified couple stress based model is presented to investigate statics, dynamics and stability of functionally graded micro-plates subjected to mechanical and thermal loadings. The features of FGM micro-plate including length scale parameter of modified couple stress theory assumed to be graded across the thickness by varying volume fractions of constituents. The governing equations of motion and boundary conditions are derived by means of Hamilton’s principle. Displacement field is expressed in a unified way capable of producing results on the base of Kirchhoff, Mindlin, and third order shear deformation theories. The system of equations is solved numerically by implementing differential quadrature method. Verification studies are carried out by comparing the results of special cases to those available in the literature. Further numerical results regarding static thermal bending, natural frequencies and critical buckling loads of micro-plates undergoing uniform temperature change are provided. Presented numerical results clearly illustrate size effect at micro-scale, impact of length scale parameter variations and influence of initial thermal displacements and stresses upon mechanical behavior of functionally graded rectangular micro-plates.

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Titel: Thermal effect on bending, buckling and free vibration of functionally graded rectangular micro-plates possessing a variable length scale parameter
verfasst von: Reza Aghazadeh
Serkan Dag
Ender Cigeroglu
Publikationsdatum: 08.02.2018
Verlag: Springer Berlin Heidelberg
Erschienen in: Microsystem Technologies / Ausgabe 8/2018
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-018-3773-x

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