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Engineering with Computers

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07.10.2021 | Original Article

Thermal post-buckling analysis of graded sandwich curved structures under variable thermal loadings

verfasst von: Brundaban Sahoo, Kulmani Mehar, Bamadev Sahoo, Nitin Sharma, Subrata Kumar Panda

Erschienen in: Engineering with Computers | Ausgabe 2/2023

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Abstract

In the present research, finite element solutions of thermal post-buckling load-bearing strength of functionally graded (FG) sandwich shell structures are reported by adopting a higher-order shear deformation type kinematics. For the numerical calculation, nine nodes are considered for each element. A specialized MATLAB code is developed incorporating the present mathematical model to evaluate the numerical buckling temperature. The Green–Lagrange nonlinear strain is adopted for the formulation of the sandwich structure. The eigenvalue equation of the FG sandwich structure is solved to predict the post-buckling temperature values of the structure. Moreover, three kinds of temperature distributions across the panel thickness are assumed, viz., uniform, linear and nonlinear. In addition, the properties are described using the power law distributions. The numerical solutions are first validated and, subsequently, the impact of alterations of structural parameters, viz., the curvature ratios, core–face thickness ratios, support conditions and power law index (n_Z) including the amplitude ratio on the thermal post-buckling response of FG sandwich curved panels have been studied in details. The investigation reveals different interesting outcomes, which may help for future references for the analysis and design of the graded sandwich structure.

Vorheriger Artikel Local thermal non-equilibrium effects in forced convection stagnation boundary layer flows in a porous medium: the Chebyshev collocation method for coupled system

Nächster Artikel A hybrid approach for interval prediction of concrete dam displacements under uncertain conditions

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Titel: Thermal post-buckling analysis of graded sandwich curved structures under variable thermal loadings
verfasst von: Brundaban Sahoo
Kulmani Mehar
Bamadev Sahoo
Nitin Sharma
Subrata Kumar Panda
Publikationsdatum: 07.10.2021
Verlag: Springer London
Erschienen in: Engineering with Computers / Ausgabe 2/2023
Print ISSN: 0177-0667
Elektronische ISSN: 1435-5663
DOI: https://doi.org/10.1007/s00366-021-01514-4

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