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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 2/2015

01.02.2015

Thermoelectric and mechanical properties of Mg–Al–Sb alloys

verfasst von: E. Altin, E. Oz, M. Erdem, S. Demirel, Y. Aydogdu, S. Altin

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2015

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Abstract

We fabricated Mg–Al–Sb alloy by arc melting system. Microstructural analyses were performed and it was found that only Mg3Sb2 and AlSb phases formed for different heat treatment conditions. The phase transition at 580 °C according to DTA analysis was determined as partial melting and it was supported by phase analyses studies in the literature. The resistivity results showed the metallic and the semiconducting type behavior depending on the heat treatment temperatures. The thermal conductivity measurement was performed in the range of 2–300 K and the data were analyzed by the sum of lattice and carrier components. The thermopower data showed negative and positive values which indicate the sign of total carriers. The linear temperature dependence of thermopower indicates metallic type characteristic of the samples. Mechanical properties of the sample showed two type hardness values dependent on heat treatment temperature.
Vorheriger Artikel Efficient photocatalyst based on ZnO nanorod arrays/p-type boron-doped-diamond heterojunction
Nächster Artikel Effect of substrate temperature on structural and optical properties of nickel tungsten oxide thin films

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Metadaten
Titel
Thermoelectric and mechanical properties of Mg–Al–Sb alloys
verfasst von
E. Altin
E. Oz
M. Erdem
S. Demirel
Y. Aydogdu
S. Altin
Publikationsdatum
01.02.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 2/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2500-3

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