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Journal of Materials Engineering and Performance

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03.03.2022 | Technical Article

Tribological Properties and Electrical Conductivity of Carbon Nanotube-Reinforced Copper Matrix Composites

verfasst von: Shaoli Fu, Xiaohong Chen, Ping Liu, Haipo Cui, Honglei Zhou, Fengcang Ma, Wei Li

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 6/2022

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Abstract

Carbon nanotube-reinforced copper matrix (CNT/Cu) composites were prepared by a method involving solution-aging treatment, in situ chemical vapor deposition (CVD), and spark plasma sintering (SPS). The tribological properties of the CNT/Cu composites were greatly improved, and the friction stability was better than that of Cu. These performance improvements were attributed to the uniform distribution of the CNTs without agglomeration and the strong interfacial bonding between the Cu matrix and CNTs. The coefficient of friction was 0.2, which was lower than that of pure copper (0.55), and the wear rate of the CNT/Cu composites was 2 times lower than that of pure copper. The wear mechanism was also discussed from the perspective of the wear morphology and interface structure. Furthermore, the electrical conductivity remained at a high level. The preparation technique is simple and easy to be controlled and can be used to synthesize CNT/Cu composites with excellent tribological properties and electrical conductivity.

Vorheriger Artikel Research on Adding Nano-SiC Reinforced Wire Arc Additive Manufacturing Stainless Steel

Nächster Artikel Effect of Tempering Treatment on Atmospheric Corrosion Behavior of 3Cr13 Martensitic Stainless Steel in Marine Environment

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Titel: Tribological Properties and Electrical Conductivity of Carbon Nanotube-Reinforced Copper Matrix Composites
verfasst von: Shaoli Fu
Xiaohong Chen
Ping Liu
Haipo Cui
Honglei Zhou
Fengcang Ma
Wei Li
Publikationsdatum: 03.03.2022
Verlag: Springer US
Erschienen in: Journal of Materials Engineering and Performance / Ausgabe 6/2022
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-022-06596-9

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