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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 8/2014

01.08.2014

Wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd solder with Sn, SnBi and Au/Ni coatings

verfasst von: Peng Xue, Song-bai Xue, Yi-fu Shen, Fei Long, Hong Zhu

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 8/2014

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Abstract

The wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd solder were investigated. The results indicated that Sn–9Zn–0.5Nd–0.08Nd solder has shown good wettability using water soluble flux and self made flux based on wetting balance testing, and solder with SnBi coating has shown superiority wettability among all three coatings. Moreover, no whisker was observed in Sn–9Zn–0.5Ga–0.08Nd solder with different coatings. But in Sn–9Zn–0.5Ga–1Nd solder, fewer whiskers were observed in solder with SnBi coating compared with Sn and Au/Ni coatings, which can be attributed to the refinement effect of Bi.
Vorheriger Artikel Low temperature synthesis of Ba(Zr0.2Ti0.8)O3–0.5(Ba0.7Ca0.3)TiO3 nanopowders by solution based auto combustion method
Nächster Artikel Comparative study of Ca3Bi(PO4)3:Eu3+ phosphors prepared by three methods

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Metadaten
Titel
Wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd solder with Sn, SnBi and Au/Ni coatings
verfasst von
Peng Xue
Song-bai Xue
Yi-fu Shen
Fei Long
Hong Zhu
Publikationsdatum
01.08.2014
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 8/2014
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2049-1

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